Semiconductor device and manufacturing method thereof

Abstract

A semiconductor device comprises: a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires. A method of manufacturing a semiconductor device comprises: preparing a base metal lead frame including a die pad and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; applying a non-benzotriazole series rustproof agent on the surface of said lead frame; performing die-bonding for fixing a semiconductor chip onto said die pad in a heated atmosphere by use of a non-metal series paste; performing wire-bonding to connect said electrodes on said semiconductor chip to the inner ends of said leads of said lead frame by use of copper wires; forming resin molded member by sealing said lead frame with a resin excluding some portions of said leads; and forming leads protruding from said resin molded member.

1 .- 6 . (Canceled)  
     
     
         7 . A method of manufacturing a semiconductor device comprising: 
 preparing a base metal lead frame including a die pad and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad;    applying a non-benzotriazole series rustproof agent on the surface of said lead frame;    performing die-bonding for fixing a semiconductor chip onto said die pad in a heated atmosphere by use of a non-metal series paste;    performing wire-bonding to connect said electrodes on said semiconductor chip to the inner ends of said leads of said lead frame by use of copper wires;    forming a resin molded member by sealing said lead frame with a resin excluding some portions of said leads; and    forming leads protruding from said resin molded member.    
     
     
         8 . The method according to  claim 7 , wherein said non-benzotriazole series rustproof agent is a fatty acid ester series rustproof agent or an amine series rustproof agent.  
     
     
         9 . The method according to  claim 7 , wherein the wire-bonding is performed at such a temperature that said non-benzotriazole series rustproof agent is decomposed.  
     
     
         10 . The method according to  claim 9 , wherein the decomposition temperature is 250° C. or higher.