Surface treating for micromachining and surface treatment method

Abstract

The present invention provides a micromachining surface treatment material for and a surface treatment method that suppress widening of the diameter of contact holes when removing a natural oxidation layer arising at bottom sections of the contact holes. The micromachining surface treatment material contains less than 0.1% hydrofluoric acid, and more than 40% by weight but less than or equal to 47% by weight of ammonium fluoride. Also, a surfactant is contained therein in an amount from 0.0001 to 0.1 % by weight.

1 . A micromacing surface treatment material containing less than 0.1% hydrofluoric acid, and more than 40% by weight, but less than or equal to 47% by weight of ammonium fluoride.  
     
     
         2 . THe micromachining surface treatment material of  claim 1 , manufactured by dissolving ammonia gas in a hydrofluoric acid solution.  
     
     
         3 . THe micromachining surface treatment material of  claim 1 , containing a surfactant at 0.0001 to 1% by weight.  
     
     
         4 . The micromachining surface treatment material of  claim 3 , said surfactant is one of, or two more of, a fatty amine (C n H 2n+1 NH 2 ; n=7 to 14), a fatty carboxylic acid (C n H 2n+1 COOH; n=5 to 11), or a fatty alcohol (C n H 2n+1 OH; n=6 to 12).  
     
     
         5 . A surface treatment method that removes a natural oxidation layer inside contact holes using the micromachining surface treatment material of  claim 1 .  
     
     
         6 . The surface treatment method of claim 5 , wherein the contact holes open to an oxidation film. oxide film is formed by CVD.  
     
     
         7 . The surface treatment method of  claim 5 , wherein the oxidation film is a TEOS type oxidation film.