Semiconductor package for improved recognition and mounting

Abstract

A semiconductor package wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.

What is claimed is:  
     
         1 . A semiconductor package having a polygon shaped top surface, said semiconductor package comprising: 
 a chamfered portion of at least one corner of said semiconductor device; and    an identification means on said semiconductor package that enables identification of said chamfered portion of said at least on corner of said semiconductor package.    
     
     
         2 . The semiconductor package according to  claim 1 , wherein said identification means comprises a square shaped display section provided on said top surface of said semiconductor package.  
     
     
         3 . The semiconductor package according to  claim 1 , wherein said identification means comprises an ink mark provided on said top surface of said semiconductor package.  
     
     
         4 . The semiconductor package according to  claim 1 , wherein said identification means is a laser mark provided on said top surface of said semiconductor package.  
     
     
         5 . The semiconductor package according to  claim 1 , wherein said identification means is a concavoconvex mark provided on said top surface of said semiconductor package.  
     
     
         6 . The semiconductor package according to  claim 1 , wherein said identification means is a concave mark provided on said top surface of said semiconductor package.  
     
     
         7 . The semiconductor package according to  claim 1 , wherein said identification means is a convex mark provided on said top surface of said semiconductor package.  
     
     
         8 . A semiconductor package having a polygon shaped top surface, said semiconductor package comprising: 
 a chamfered portion of at least one corner of said semiconductor device; and    an identifier on said semiconductor package that enables identification of said chamfered portion of said at least on corner of said semiconductor package.    
     
     
         9 . The semiconductor package according to  claim 8 , wherein said identifier comprises a square shaped display section provided on said top surface of said semiconductor package.  
     
     
         10 . The semiconductor package according to  claim 8 , wherein said identifier comprises an ink mark provided on said top surface of said semiconductor package.  
     
     
         11 . The semiconductor package according to  claim 8 , wherein said identifier is a laser mark provided on said top surface of said semiconductor package.  
     
     
         12 . The semiconductor package according to  claim 8 , wherein said identifier is a concavoconvex mark provided on said top surface of said semiconductor package.  
     
     
         13 . The semiconductor package according to  claim 8 , wherein said identifier is a concave mark provided on said top surface of said semiconductor package.  
     
     
         14 . The semiconductor package according to  claim 8 , wherein said identifier is a convex mark provided on said top surface of said semiconductor package.