Inspection apparatus and probe card

Abstract

An object of the present invention is to provide an inspecting device equipped with a probe card capable of inspecting an object to be inspected appropriately even at heating or cooling time. The inspecting device of the present invention is an inspecting device equipped with a performance substrate provided with a terminal for inspection; a contactor substrate provided with a probe contacting an object to be inspected; and a probe card intervening between the probe of conductor substrate and a terminal of performance substrate, wherein the probe card is a multi-layered substrate in which a resin thin film is laminated on a ceramic board.

What is claimed:  
     
         1 . A probe card configured to be used to inspect integrated circuits formed on a semiconductor-wafer, comprising: 
 a resin insulating layer and a conductor circuit serially formed in alternate fashion and in repetition on a ceramic board.    
     
     
         2 . The probe card according to  claim 1 , 
 wherein a conductor-filled through hole is formed in said ceramic board.    
     
     
         3 . The probe card according to  claim 1 , 
 wherein resultant conductor circuits formed through said resin layer are interconnected each other by a via hole.    
     
     
         4 . The probe card according to  claim 1 , wherein said ceramic board comprises non-oxide ceramic.  
     
     
         5 . The probe card according to  claim 1 , wherein said resin layer comprises thermosetting resin.  
     
     
         6 . The probe card according to  claim 1 , wherein said ceramic board has a disc shape.  
     
     
         7 . The probe card according to  claim 1 , wherein said resin layer is formed so as to cover a whole of at least one main face of said ceramic board.