Inspecting device and probe card

Abstract

An object of the present invention is to provide an inspecting device equipped with a probe card capable of inspecting an object to be inspected appropriately even at heating or cooling time. The inspecting device of the present invention is an inspecting device equipped with a performance substrate provided with a terminal for inspection; a contactor substrate provided with a probe contacting an object to be inspected; and a probe card intervening between the probe of conductor substrate and a terminal of performance substrate, wherein the probe card is a multi-layered substrate in which a resin thin film is laminated on a ceramic board.

What is claimed:  
     
         1 . An inspecting device comprising: 
 a performance substrate provided with a terminal configured to perform an inspection;    a contactor substrate provided with a probe configured to contact an object to be inspected;    and a probe card,    wherein said probe card comprises a multi-layered substrate in which a resin thin film is laminated on a ceramic board.    
     
     
         2 . An inspecting device comprising: 
 a performance substrate provided with a terminal configured to perform an inspection;    a contactor substrate provided with a probe configured to contact an object to be inspected; and    a probe card intervening between said probe of said contactor substrate and said terminal of said performance substrate,    wherein said probe card comprises a multi-layered substrate in which a resin thin film is laminated on a ceramic board.    
     
     
         3 . An inspecting device equipped with: 
 a performance substrate provided with a terminal configured to perform an inspection;    a contactor substrate provided with a probe configured to contact an object to be inspected; and    a probe card configured to be electrically connected to said probe of said contactor substrate,    wherein said inspecting device is configured such that the object to be inspected is placed between said performance substrate and said probe card, and    wherein said probe card comprises a multi-layered substrate in which a resin thin film is laminated on a ceramic board.    
     
     
         4 . The inspecting device according to  claim 1 , wherein the ceramic board of said probe card comprises non-oxide ceramic.  
     
     
         5 . The inspecting device according to  claim 1 , wherein said resin thin film comprises thermosetting resin.  
     
     
         6 . A probe card configured to be used to inspect integrated circuits formed on a semiconductor-wafer, comprising: 
 a resin insulating layer and a conductor circuit serially formed in alternate fashion and in repetition on a ceramic board.    
     
     
         7 . The probe card according to  claim 6 , 
 wherein a conductor-filled through hole is formed in said ceramic board.    
     
     
         8 . The probe card according to  claim 6 , 
 wherein resultant conductor circuits formed through said resin layer are interconnected each other by a via hole.    
     
     
         9 . The probe card according to  claim 6 , wherein said ceramic board comprises non-oxide ceramic.  
     
     
         10 . The probe card according to  claim 6 , wherein said resin layer comprises thermosetting resin.  
     
     
         11 . The probe card according to  claim 6 , wherein said ceramic board has a disc shape.  
     
     
         12 . The probe card according to  claim 6 , wherein said resin layer is formed so as to cover a whole of at least one main face of said ceramic board.