US2004206622A1PendingUtilityA1
Apparatus for plating treatment
Priority: Jul 25, 2001Filed: Jul 24, 2002Published: Oct 21, 2004
Est. expiryJul 25, 2021(expired)· nominal 20-yr term from priority
C25D 17/02H10P 14/47H10W 72/251H10W 72/012
39
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A plating processing device is so arranged that at least a part of a portion touching plating liquid is made of a material whose change rate of surface roughness in response to a removing agent is lower than resin when the material and the resin are measured in the same conditions. For example, a storage tank ( 1 ), a plating processing tank ( 2 ), a buffer tank ( 3 ), and a pipe ( 9 ) are made of hard glass and quartz glass. With this, it is possible to prevent a plating material from being deposited as foreign body on wall surfaces of the plating processing tank, etc.
Claims
exact text as granted — not AI-modified1 . A plating processing device which plates a plating target object by supplying plating liquid containing a plating material and causing said plating target object to touch said plating liquid, and, if the plating material is deposited on an undesired position, removes the plating material from the undesired position using a removing agent, wherein:
at least a part of a portion touching said plating liquid is made of a material whose change rate of surface roughness in response to the removing agent is lower than resin when said material and the resin are measured in same conditions.
2 . The plating processing device as set forth in claim 1 , comprising:
a plating processing tank for causing said plating target object to touch said plating liquid, wall surfaces of said plating processing tank being made of a material whose change rate of surface roughness in response to the removing agent is lower than resin when said material and the resin are measured in same conditions.
3 . The plating processing device as set forth in claim 1 , comprising:
a plating processing tank for causing said plating target object to touch said plating liquid; and a plating processing tank pipe for conveying said plating liquid to said plating processing tank, wall surfaces of said plating processing tank pipe being made of a material whose change rate of surface roughness in response to the removing agent is lower than resin when said material and the resin are measured in same conditions.
4 . The plating processing device as set forth in claim 1 , comprising:
a plating processing tank for causing said plating target object to touch said plating liquid; and a storage tank for storing said plating liquid which is to be supplied to said plating processing tank, wall surfaces of said storage tank being made of a material whose change rate of surface roughness in response to the removing agent is lower than resin when said material and the resin are measured in same conditions.
5 . The plating processing device as set forth in claim 4 , further comprising:
a heating tank for containing said storage tank so as to heat said plating liquid in said storage tank using heat conduction.
6 . The plating processing device as set forth in claim 1 , further comprising:
a plating processing tank for causing said plating target object to touch said plating liquid; a plating processing tank pipe for conveying said plating liquid to said plating processing tank; and an ultrasonic flowmeter provided at a portion of said plating processing tank pipe, wall surfaces of said portion of said plating processing tank pipe being made of a material whose change rate of surface roughness in response to the removing agent is lower than resin when said material and the resin are measured in same conditions.
7 . The plating processing device as set forth in claim 1 , wherein:
said material whose change rate of surface roughness in response to the removing agent is lower than resin when said material and the resin are measured in same conditions is glass.
8 . The plating processing device as set forth in claim 7 , wherein:
said glass is hard glass.
9 . The plating processing device as set forth in claim 7 , wherein:
said glass is quartz glass.Join the waitlist — get patent alerts
Track US2004206622A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.