Electronic component and fabricating method

Abstract

An LSI unit provided by the present invention comprises a molded LSI chip having bonding pads, and another LSI chip having another set of bonding pads which is placed on the molded LSI chip and electrically connected the molded LSI chip through bumps. In this LSI unit, the LSI chip is molded in a molding material, a re-wiring layer is formed, and bonding pads of the molded LSI chip are formed so as to correspond to the position of another set of bonding pads of another LSI chip, where the bonding pads of the molded LSI chip are formed over the molding material. Thus another LSI chip even larger in size than the molded LSI chip can be placed on the molded LSI chip and can be electrically connected thereto.

1 - 3 . (Canceled)  
     
     
         4 . A method of fabricating an electronic component comprising: 
 a first step for attaching an adhesive member, which exhibits adhesiveness lower after a predetermined process, on a flat substrate;    a second step for placing two or more electronic devices on said adhesive member while directing an active surfaces of said electronic devices face-down;    a third step for molding said electronic devices using a molding material on said flat substrate;    a fourth step for subjecting said adhesive member to said predetermined process to lower the adhesive force of said adhesive member, and for separating said molded electronic devices from said flat substrate;    a fifth step for forming a re-wiring layer on said molded electronic devices using a metal thin film for forming bonding pads;    a sixth step for placing other electronic devices on said molded electronic devices while allowing the active surfaces of both electronic devices to oppose each other, and for electrically connecting both electric devices through said bonding pads; and    a seventh step for dicing said molded unit including said electronic devices at the molding material so as to separate the individual molded units.    
     
     
         5 . The method of fabricating an electronic component as claimed in  claim 4 , wherein said electronic devices are a semiconductor chips.  
     
     
         6 . The method of fabricating an electronic component as claimed in  claim 4 , wherein said bonding pads are formed on said molding material.