Semiconductor device and method of manufacturing the same

Abstract

A method of manufacturing a semiconductor device, comprises providing a wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film. A semiconductor chip is adhesively fixed to the insulating film. Conductive wires connect the electrodes on the main surface of the wiring substrate and electrodes on the chip. A groove is formed between the chip and the electrodes on the substrate. A protruding portion of the adhesive stays within the groove and does not reach the electrodes on the substrate.

1 - 30 . (Cancelled)  
     
     
         31 . A method of manufacturing a semiconductor device, comprising the steps of: 
 providing a wiring substrate including a main surface, an insulating film formed on the main surface, and a plurality of electrodes formed on the main surface, a surface of the plurality of electrodes being exposed from the insulating film;    providing a semiconductor chip having a main surface and a back surface, a plurality of semiconductor elements and a plurality of electrodes being formed on the main surface of the semiconductor chip;    fixing the semiconductor chip to the insulating film through a pasty adhesive;    after the fixing step, connecting one end of a plurality of conductive wires to the plurality of electrodes on the main surface of the wiring substrate;    covering the semiconductor chip, the main surface of the wiring substrate and the plurality of conductive wires with a sealing resin;    wherein previous to the fixing step, a groove is formed between the plurality of electrodes formed on the main surface of the wiring substrate and the semiconductor chip, and the fixing step is performed so as to allow a protruding portion of the pasty adhesive flowing out to the outside of the semiconductor chip to stay in the groove so as not to reach the plurality of electrodes formed on the main surface of the wiring substrate, and    wherein the pasty adhesive is formed on a peripheral surface of the semiconductor chip as a slope surface by a raised portion of the pasty adhesive.    
     
     
         32 . A semiconductor device according to  claim 31 , wherein the plurality of conductive wires are electrically connected between the plurality of electrodes on the main surface of the wiring substrate and the plurality of electrodes on the main surface of the semiconductor chip.