Method for making a radio frequency component and component produced thereby

Abstract

A method for making a radio frequency (RF) component includes forming a dielectric layer on a semiconductor substrate and forming and patterning a conductive layer on the dielectric layer to define the RF component. The dielectric layer may include SiN, the conductive layer may include aluminum, and the semiconductor substrate may include silicon, for example. At least one opening may be formed through the RF component at least to the semiconductor substrate. Moreover, the at least one opening may either extend into the semiconductor substrate or substantially terminate at a surface of the semiconductor substrate. The RF component may then be released from the semiconductor substrate by exposing the semiconductor substrate to an etchant passing through the at least one opening to the semiconductor substrate. Releasing the RF component may include exposing the semiconductor substrate to a dry etchant, such as XeF 2 , for example.

1 - 28  (Canceled)  
     
     
         29 . A radio frequency (RF) component comprising: 
 a dielectric layer having opposing first and second major surfaces, the first surface being free from a semiconductor substrate, said dielectric layer having a plurality of openings extending between the first and second opposing major surfaces; and    a patterned conductive layer on the second major surface of said dielectric layer.    
     
     
         30 . The RF component of claiming  29  wherein said plurality of openings are arranged in a predetermined pattern.  
     
     
         31 . The RF component of  claim 30  wherein the predetermined pattern has substantially uniform spacing between adjacent openings.  
     
     
         32 . The RF component of claim  1  wherein the substantially uniform spacing is in a range of about 20 to about 200 um.  
     
     
         33 . The RF component of claim  9  wherein each opening has a diameter in a range of about 0.5 to 20 um.  
     
     
         34 . The RF component of claim  119  wherein each opening has respective rounded over edges adjacent the first and second major surfaces.  
     
     
         35 . The RF component of  claim 29  wherein the plurality of openings are laterally adjacent portions of the conductive layer with no openings extending through the conductive layer.