Method of producing a glass substrate for a mask blank and method of producing a mask blank
Abstract
A method of producing a glass substrate for a mask blank has the steps of measuring a convex/concave profile of a surface of the glass substrate, controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value by specifying the degree of convexity of a convex portion present on the surface of the glass substrate with reference to a result of measurement obtained in the profile measuring step and executing local machining upon the convex portion under a machining condition depending upon the degree of convexity, and polishing, after the flatness control step, the surface of the glass substrate subjected to the local machining by the action of a machining liquid interposed between the surface of the glass substrate and a surface of a polishing tool without direct contact therebetween.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of producing a glass substrate for a mask blank, the method comprising:
a profile measuring step of measuring a convex/concave profile of a surface of the glass substrate for a mask blank; a flatness control step of controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value by specifying the degree of convexity of a convex portion present on the surface of the glass substrate with reference to a result of measurement obtained in the profile measuring step and executing local machining upon the convex portion under a machining condition depending upon the degree of convexity; and a non-contact polishing step of polishing, after the flatness control step, the surface of the glass substrate subjected to the local machining by the action of a machining liquid interposed between the surface of the glass substrate and a surface of a polishing tool without direct contact therebetween.
2 . A method according to claim 1 , wherein the non-contact polishing step is carried out by float polishing.
3 . A method according to claim 1 or 2 , wherein:
the machining liquid comprises:
an aqueous solution selected from water, an acidic aqueous solution, and an alkaline aqueous solution; or
a mixture of the aqueous solution and at least one kind of fine powder particles selected from colloidal silica, cerium oxide, zirconium oxide, and aluminum oxide.
4 . A method according to any one of claims 1 through 3 , wherein the local machining is carried out by plasma etching or a gas cluster ion beam.
5 . A method according to any one of claims 1 through 4 , wherein the reference value is not greater than 0.25 μm.
6 . A method of producing a mask blank, the method comprising the steps of preparing the glass substrate obtained by the method according to any one of claims 1 to 5 , and forming a thin film as a transferred pattern on the glass substrate.
7 . A method of producing a transfer mask, the method comprising the steps of preparing the mask blank obtained by the method according to claim 6 and patterning the thin film of the mask blank to form a thin film pattern on the glass substrate.
8 . A method of producing a semiconductor device, the method comprising the steps of preparing the transfer mask obtained by the method according to claim 7 and transferring the thin film pattern of the transfer mask onto a semiconductor substrate by lithography.Join the waitlist — get patent alerts
Track US2004192171A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.