Camera module

Abstract

A camera module includes a lens 11 , an optical tube 12 for supporting the lens 1 , and an image sensor chip 2 for outputting image signals based on the light coming through the lens 11 . The optical tube 12 is attached to the image sensor chip 2 . The image sensor chip 2 has a sensor portion 21 and a logic circuit portion 22 on one surface thereof, and the optical tube 12 is attached to the logic circuit portion 22 . In this structure, a camera module can be downsized and achieve high focus accuracy.

1 . A camera module comprising: 
 a lens unit comprising a lens and a lens supporting structure for supporting the lens; and    an image sensor chip for processing image signals based on light coming through the lens,    wherein the lens unit is attached to the image sensor chip, and    the image sensor chip comprises a bump for substrate connection in an area outside of an area where the lens unit is mounted.    
     
     
         2 . A camera module comprising: 
 a lens unit comprising a lens and a lens supporting structure for supporting the lens; and    an image sensor chip comprising a sensor portion and a logic circuit portion on one surface thereof for processing image signals based on light coming through the lens,    wherein the lens unit is attached to the logic circuit portion of the image sensor chip.    
     
     
         3 . A camera module comprising: 
 a lens unit comprising a lens and a lens supporting structure for supporting the lens; and    an image sensor chip for processing image signals based on light coming through the lens,    wherein the image sensor chip comprises a chip size package rewiring layer having an optical window, and    the lens unit is attached to the image sensor chip in an area of the optical window.    
     
     
         4 . A camera module comprising: 
 a lens unit comprising a lens and a lens supporting structure for supporting the lens;    an image sensor chip for processing image signals based on light coming through the lens; and    a wiring substrate having a window portion,    wherein the lens unit is attached to the wiring substrate and the image sensor chip in such a way of being inserted into the window portion of the wiring substrate.    
     
     
         5 . The camera module according to  claim 4 , wherein the image sensor chip and the wiring substrate are electrically connected by a solder bump.  
     
     
         6 . The camera module according to  claim 4 , wherein the image sensor chip and the wiring substrate are electrically connected by anisotropic conductive material.  
     
     
         7 . A method for manufacturing a camera module, comprising: 
 a step of attaching a plurality of lens supporting structures for supporting lenses to a wafer comprising a plurality of image sensor chips for processing image signals based on incoming light; and    a step of dicing the wafer having the lenses attached thereto into chip size pieces.    
     
     
         8 . A method for manufacturing a camera module according to  claim 7 , further comprising 
 a step of inserting a lens of an image sensor chip diced out of the wafer into a window portion of a wiring substrate, and attaching the image sensor chip to the wiring substrate.    
     
     
         9 . A method for manufacturing a camera module including a lens unit comprising a lens and a lens supporting structure for supporting the lens, an image sensor chip for processing image signals based on light coming through the lens, and a wiring substrate having a window portion, comprising: 
 a step of fabricating a camera module in which the lens unit is attached to the image sensor chip; and    a step of inserting and attaching the lens unit of the camera module into the window portion of the wiring substrate.    
     
     
         10 . A method for manufacturing a camera module according to  claim 9 , 
 wherein the image sensor chip comprises a sensor portion and a logic circuit portion on one surface thereof, and the lens unit is attached to the logic circuit portion.