Epoxy resin composition and semiconductor apparatus

Abstract

The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties. According to the present invention, there is provided an epoxy resin composition for semiconductor encapsulation which comprises, as essential components, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m 2 /g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin as a curing agent, and (F) a curing accelerator, in which said ultrafine silica is contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition, and said silicone compound is a polyorganosiloxane and is contained in an amount of 0.3-2.0% by weight based on the total weight of the resin composition.

1 : An epoxy resin composition for encapsulation of semiconductors which comprises, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m 2 /g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin curing agent, and (F) a curing accelerator, said ultrafine silica being contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition.  
     
     
         2 : An epoxy resin composition according to  claim 1 , wherein the silicone compound (C) is a polyorganosiloxane and the amount of the silicone compound is 0.3-2.0% by weight based on the total weight of the resin composition.  
     
     
         3 : A semiconductor apparatus in which a semiconductor element is mounted on one side of a substrate and substantially only the one side of the substrate on which the semiconductor element is mounted is encapsulated with the epoxy resin composition for semiconductor encapsulation of  claim 1 .  
     
     
         4 : A semiconductor apparatus in which a semiconductor element is mounted on one side of a substrate and substantially only the one side of the substrate on which the semiconductor element is mounted is encapsulated with the epoxy resin composition for semiconductor encapsulation of  claim 2 .  
     
     
         5 : A method of encapsulating a semiconductor apparatus having a semiconductor element mounted on one side of a substrate, comprising encapsulating substantially only the one side of the substrate on which the semiconductor element is mounted with the epoxy resin composition of  claim 1 .  
     
     
         6 : A method of encapsulating a semiconductor apparatus having a semiconductor element mounted on one side of a substrate, comprising encapsulating substantially only the one side of the substrate on which the semiconductor element is mounted with the epoxy resin composition of  claim 2.