Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device in which it is installed

Abstract

Wafer holder and semiconductor manufacturing equipment in which the holder is installed, the wafer holder having a wafer-carrying surface, wherein incidence of warping and cracking when the wafer holder is heated is slight. In the wafer holder having a wafer-carrying surface, electrical circuitry consisting of one or more sinter laminae is formed on the face or in the interior of the wafer holder; and by rendering pores present in the circuitry, the incidence of warping and cracking can be made very slight. The electrical circuitry is preferably any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit.

What is claimed is:  
     
         1 . A wafer holder for semiconductor manufacturing equipment, the wafer holder having a surface for carrying wafers and comprising a layer of electrical circuitry composed of one or more sinter laminae, formed either on the face or in the interior of the wafer holder, said circuit layer having porosity in that pores are present therein.  
     
     
         2 . A wafer holder as set forth in  claim 1 , wherein: 
 said circuit layer is as its main constituent one or more metals selected from tungsten, molybdenum and tantalum; and    said porosity is 0.1% or more.    
     
     
         3 . A wafer holder as set forth in  claim 1 , wherein: 
 said circuit layer is as its main constituent one or more metals selected from silver, vanadium and platinum; and    said porosity is 2% or more.    
     
     
         4 . A wafer holder as set forth in  claim 2 , wherein said electrical circuitry any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit.  
     
     
         5 . A wafer holder as set forth in  claim 3 , wherein said electrical circuitry any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit.  
     
     
         6 . Semiconductor manufacturing equipment wherein the wafer holder set forth in  claim 1  is installed.  
     
     
         7 . Semiconductor manufacturing equipment wherein the wafer holder set forth in  claim 2  is installed.  
     
     
         8 . Semiconductor manufacturing equipment wherein the wafer holder set forth in  claim 3  is installed.  
     
     
         9 . Semiconductor manufacturing equipment wherein the wafer holder set forth in  claim 4  is installed.  
     
     
         10 . Semiconductor manufacturing equipment wherein the wafer holder set forth in  claim 5  is installed.