US2004179310A1PendingUtilityA1
Embedded lapping guide
Priority: Mar 16, 2001Filed: Mar 29, 2004Published: Sep 16, 2004
Est. expiryMar 16, 2021(expired)· nominal 20-yr term from priority
B24B 49/04B24B 37/048G11B 5/3103G11B 5/3173Y10T29/49037G11B 5/1871B24B 37/013B24B 49/10G11B 5/3967G11B 5/3116G11B 5/3948G11B 5/3166
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Claims
Abstract
A magnetic head cluster is provided along with a method of making a magnetic head cluster. The magnetic head cluster comprises a substrate having a plurality of magnetoresistive (MR) read and inductive magnetic write transducers and a plurality of terminals formed thereon. A plurality of lapping guides are also provided on the substrate between adjacent transducers.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A magnetic head cluster comprising:
a substrate; at least two transducer elements disposed on a surface of the substrate; and at least one resistive element disposed on the surface of the substrate between two of the at least two transducer elements.
2 . A magnetic head cluster in accordance with claim 1 , further comprising a plurality of resistive elements, and wherein each of the plurality of resistive elements is disposed on the surface of the substrate between two of the at least two transducer elements.
3 . A magnetic head cluster in accordance with claim 2 , wherein at least one of the at least two transducer elements includes a magnetoresistive read head and an inductive magnetic write head.
4 . A magnetic head cluster in accordance with claim 3 , wherein at least one of the plurality of resistive elements is an analog switch lapping guide.
5 . A magnetic head cluster in accordance with claim 4 , wherein at least one of the plurality of resistive elements is a digital switch lapping guide.
6 . A magnetic head cluster in accordance with claim 3 , wherein at least one of the plurality of resistive elements is a digital switch lapping guide.
7 . A magnetic head cluster in accordance with claim 3 , further comprising at least one terminal disposed on the surface of the substrate.
8 . A magnetic head cluster in accordance with claim 2 , wherein at least one of the at least two transducer elements includes a read head selected from a group consisting of anisotropic magnetoresistive read heads, giant magnetoresistive read heads, and spin valve read heads.
9 . A magnetic head cluster comprising:
a substrate having a surface and a plurality of edge portions; at least two transducer elements disposed on the surface of the substrate, each of the at least two transducer elements being adjacent to at least one of the plurality of edge portions; and at least one resistive element disposed on the surface of the substrate, wherein none of the at least one resistive elements are positioned between any one of the at least two transducer elements and a respective adjacent edge portion.
10 . A magnetic head cluster in accordance with claim 9 , wherein at least one of the at least two transducer elements includes a read head selected from a group consisting of anisotropic magnetoresistive read heads, giant magnetoresistive read heads, and spin valve read heads.
11 . A magnetic head cluster in accordance with claim 10 , wherein at least one of the plurality of resistive elements is selected from a group consisting of analog switch lapping guides and digital switch lapping guides.
12 . A magnetic head cluster in accordance with claim 11 , further comprising at least one terminal disposed on the surface of the substrate.
13 . A magnetic head cluster in accordance with claim 9 , wherein at least one of the at least two transducer elements includes a magnetoresistive read head and an inductive magnetic write head.
14 . A method of fabricating a magnetic head cluster comprising the steps of:
providing a substrate; forming at least two transducer elements on a surface of the substrate; and forming at least one resistive element on the surface of the substrate between two of the at least two transducer elements.
15 . A method of fabricating a magnetic head cluster in accordance with claim 14 , further comprising the step lapping an edge portion of the magnetic head cluster.
16 . A method of fabricating a magnetic head cluster in accordance with claim 15 , further comprising the step of measuring the resistance of the at least one resistive element.
17 . A method of fabricating a magnetic head cluster in accordance with claim 16 , wherein the step of measuring the resistance is performed during the step of lapping, and wherein the step of lapping is performed until the resistance of at least one of the resistive elements reaches a specified resistance.
18 . A method of fabricating a magnetic head cluster in accordance with claim 15 , further comprising a plurality of resistive elements, and wherein each of the plurality of resistive elements is formed on the surface of the substrate between two of the at least two transducer elements.
19 . A method of fabricating a magnetic head cluster in accordance with claim 18 , further comprising the step of measuring the resistance of at least one of the plurality of resistive elements.
20 . A method of fabricating a magnetic head cluster in accordance with claim 19 , wherein the step of measuring the resistance is performed during the step of lapping, and wherein the step of lapping is performed until the resistance of at least one of the resistive elements reaches a predetermined resistance.
21 . A method of fabricating a magnetic head cluster in accordance with claim 15 , wherein at least one of the plurality of resistive elements is selected from a group consisting of analog switch lapping guides and digital switch lapping guides.Join the waitlist — get patent alerts
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