Reel-type package of flexible printed circuit boards and method for supplying thereof

Abstract

A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

What is claimed:  
     
         1 . A method for reel-type packaging flexible printed circuit boards (FPCs), comprising: 
 cutting a flexible plate having a plurality of FPC patterns to form bar-like materials, wherein each of said bar-like materials has a plurality of aligned FPCs; and    winding said bar-like materials one by one onto a reel to form a reel-type package so as to prevent said FPCs from crumpling, curving and deforming when suffering an external force.    
     
     
         2 . The method of  claim 1 , wherein a layer of an antistatic cushion is used to pad said bar-like material while said bar-like material is to be wound onto said reel and then is wound together with said bar-like material.  
     
     
         3 . A supplying method for a processing machine to adhesively press flexible printed circuit boards (FPCs) on a glass substrate, comprising: 
 providing a FPCs reel-type package formed by winding bar-like materials having a plurality of said FPCs one by one onto a reel;    transporting said bar-like materials to a punching device;    cutting said bar-like material along the periphery of one of said FPCs on said bar-like material by said punching device to form a piece of FPC; and    transporting said piece of FPC to said processing machine.    
     
     
         4 . The supplying method of  claim 3 , wherein a layer of an antistatic cushion is used to pad said bar-like material while said bar-like material is to be wound onto said reel and then is wound together with said bar-like material.  
     
     
         5 . The supplying method of  claim 3 , wherein a color filter and a large scale integration chip have been defined on the surface of said glass substrate before said FPC is adhesively pressed on said glass substrate.  
     
     
         6 . A process system for adhesively pressing flexible printed circuit boards (FPCs) on a glass substrate, comprising: 
 a FPCs reel-type package, formed by winding bar-like materials having a plurality of said FPCs one by one onto a reel;    a punching device, cutting said bar-like materials sequentially to produce a multiple pieces of said FPCs;    a transporting arm, sucking said FPC cut out by said punching device and transporting it to a positioning device; and    a pre-press head, located above said positioning device, sucking said FPC transported to said positioning device, transporting it to the top of said glass substrate and pressing said FPC on the surface of said glass substrate.    
     
     
         7 . The process system of  claim 6 , wherein said bar-like material is padded with a layer of an antistatic cushion.  
     
     
         8 . The process system of  claim 6 , wherein a color filter and a large scale integration chip have been defined on the surface of said glass substrate before said FPC is pressed on said glass substrate.