Apparatus for cleaning a substrate having metal interconnects

Abstract

The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises a cleaning mechanism for cleaning the substrate, and a functional water supply mechanism for supplying functional water to the cleaning mechanism. The cleaning mechanism cleans a surface of the substrate with use of the functional water.

What is claimed is:  
     
         1 . A cleaning apparatus for cleaning a substrate having metal interconnects, comprising: 
 a cleaning mechanism for cleaning the substrate; and    a functional water supply mechanism for supplying functional water to said cleaning mechanism;    wherein said cleaning mechanism cleans a surface of the substrate with use of the functional water.    
     
     
         2 . A cleaning apparatus according to  claim 1 , wherein said functional water supply mechanism produces gas-dissolved water as the functional water.  
     
     
         3 . A cleaning apparatus according to  claim 1 , wherein said functional water supply mechanism comprises a water electrolyzing device for electrolyzing water to produce electrolytic water as the functional water.  
     
     
         4 . A cleaning apparatus according to  claim 2 , wherein said functional water supply mechanism comprises a water electrolyzing device for electrolyzing water to produce electrolytic water as the functional water.  
     
     
         5 . A cleaning apparatus according to  claim 1 , wherein said cleaning mechanism comprises at least one of a mechanism having a cleaning member for scrubbing the surface of the substrate, a mechanism having a cleaning member which is rotated on the surface of the substrate, a mechanism for applying an ultrasonic wave to the functional water, a mechanism for generating cavitation in the functional water, and a mechanism for generating cavitation in the functional water and applying an ultrasonic wave to the functional water.  
     
     
         6 . A cleaning apparatus according to  claim 1 , wherein metal or ally for forming the metal interconnects contains at least one of aluminum, tungsten, and titanium nitride.  
     
     
         7 . A cleaning apparatus according to  claim 2 , wherein the functional water comprises gas-dissolved water containing at least one of CO 2  and O 3 .