US2004173892A1PendingUtilityA1

Multilayer laser trim interconnect method

39
Priority: Jul 17, 2002Filed: Mar 15, 2004Published: Sep 9, 2004
Est. expiryJul 17, 2022(expired)· nominal 20-yr term from priority
Inventors:Noboru Nakanishi
H10W 90/756H10W 90/754H10W 90/736H10W 90/734H10W 90/00H10W 74/00H10W 72/07553H10W 72/5449H10W 72/5363H10W 72/951H10W 72/932H10W 72/884H10W 72/874H10W 72/551H10W 72/536H10W 72/531H10W 72/251H10W 72/075H10W 70/093H10W 72/012H10W 70/60H10W 72/9445H10W 70/614
39
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Claims

Abstract

A method for creating electrical interconnects between a semiconductor die and package. In the preferred embodiment, an insulating material is applied over the die and extends to the substrate contact pads, leaving a portion of each contact pad exposed. Holes are then trimmed through the insulating material, exposing at least a portion of each die bond pad. A conductive material is then applied over the die, flowing into the holes, contacting the die bond pads, and extending out to contact at least a portion of each substrate contact pad. In another preferred embodiment, an electrically conductive bump may be formed on each die bond pad, protruding through said non-conductive material and at least partially through said conductive material. The conductive layer is then laser trimmed, forming conductive patches that serve as electrical interconnects between the die and package substrate.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method of electrically connecting a semiconductor die to a package substrate, comprising: 
 (a) applying an electrically non-conductive material covering at least a portion of said die and extending onto said substrate to a plurality of contact pads formed on said substrate; and    (b) applying an electrically conductive material over said non-conductive material and extending from an electrical point of contact of said die to at least one contact pad on said substrate.    
     
     
         2 . A method as claimed in  claim 1 , wherein the conductive material is separated into a plurality of conductive patches by laser trimming away portions of the conductive material.  
     
     
         3 . A method as claimed in  claim 1 , wherein a hole is trimmed into the non-conductive material over and down to the bond pads, exposing at least a portion of each bond pad to be connected.  
     
     
         4 . A method as claimed in  claim 1 , wherein an electrically conductive bump is formed on each said die bond pad, said bump protruding through said non-conductive material and at least partially through said conductive material.  
     
     
         5 . A method as claimed in  claim 1 , wherein the insulating layer comprises a non-conductive epoxy.  
     
     
         6 . A method as claimed in  claim 1 , wherein the insulating layer comprises a non-conductive polyimide.  
     
     
         7 . A method as claimed in  claim 1 , wherein the conductive layer comprises conductive ink.  
     
     
         8 . A method as claimed in  claim 1 , wherein the conductive layer comprises a metal ion coating.  
     
     
         9 . A method as claimed in  claim 1 , wherein (a) includes spinning the non-conductive material onto the die and package substrate.  
     
     
         10 . A method as claimed in  claim 1 , wherein (a) includes spraying the non-conductive material onto the die and package substrate.  
     
     
         11 . A method as claimed in  claim 1 , wherein (b) includes spinning the non-conductive material onto the die and package substrate.  
     
     
         12 . A method as claimed in  claim 1 , wherein (b) includes spraying the non-conductive material onto the die and package substrate.  
     
     
         13 . A semiconductor device formed by the process of: 
 (a) applying an electrically non-conductive material covering at least a portion of said die and extending onto said substrate to a plurality of contact pads formed on said substrate; and    (b) applying an electrically conductive material over said non-conductive material and extending from an electrical point of contact of said die to at least one contact pad on said substrate.    
     
     
         14 . A device as claimed in  claim 13 , wherein the conductive material is separated into a plurality of conductive patches by laser trimming away portions of the conductive material.  
     
     
         15 . A device as claimed in  claim 13 , wherein a hole is trimmed into the non-conductive material over and down to the bond pads, exposing at least a portion of each bond pad to be connected.  
     
     
         16 . A device as claimed in  claim 13 , wherein an electrically conductive bump is formed on each said die bond pad, said bump protruding through said non-conductive material and at least partially through said conductive material.  
     
     
         17 . A device as claimed in  claim 13 , wherein the insulating layer comprises a non-conductive epoxy.  
     
     
         18 . A device as claimed in  claim 13 , wherein the insulating layer comprises a non-conductive polyimide.  
     
     
         19 . A device as claimed in  claim 13 , wherein the conductive layer comprises conductive ink.  
     
     
         20 . A device as claimed in  claim 13 , wherein the conductive layer comprises a metal ion coating.  
     
     
         21 . A device as claimed in  claim 13 , wherein (a) includes spinning the non-conductive material onto the die and package substrate.  
     
     
         22 . A device as claimed in  claim 13 , wherein (a) includes spraying the non-conductive material onto the die and package substrate.  
     
     
         23 . A device as claimed in  claim 13 , wherein (b) includes spinning the non-conductive material onto the die and package substrate.  
     
     
         24 . A device as claimed in  claim 13 , wherein (b) includes spraying the non-conductive material onto the die and package substrate.

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