Substrate for forming specific pattern, and method for manufacturing the same

Abstract

The present invention is a substrate for forming a patterned thin film by causing a specific fluid to adhere. More particularly, this substrate comprises a pattern formation region that is patterned in a specific shape in order to form a film. This pattern formation region is constituted such that an affinity region having an affinity to the fluid is disposed according to specific rules within a non-affinity region not having an affinity to the fluid. The fluid can be uniformly made to adhere to the required region, without spreading out too much or splitting up, allowing a uniform thin film to be formed.

What is claimed is:  
     
         1 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 forming a paraffin layer by applying a paraffin coating to a base that exhibits an affinity to the fluid; and    removing said paraffin layer by supplying energy to a region to be an affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed.    
     
     
         2 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 forming a paraffin layer by applying a paraffin coating to a base that exhibits no affinity to the fluid;    removing said paraffin layer by supplying energy to a region to be a non-affinity region not having an affinity to said fluid such that an affinity region having an affinity to said fluid and said non-affinity region are formed in a pattern formation region in which said patterned thin film is formed; and    removing said paraffin layer by supplying energy to a region to be a pattern non-formation region in which a patterned thin film is not formed.    
     
     
         3 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 forming a metal layer on a base that exhibits an affinity to the fluid;    removing said metal layer by supplying energy to a region to be an affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed; and    immersing said base from which the metal has been selectively removed in a mixed liquid containing a sulfur compound.    
     
     
         4 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of 
 forming a metal layer on a base that exhibits no affinity to the fluid;    removing said metal layer by supplying energy to the region other than the pattern formation region in which said patterned thin film is formed;    removing said metal layer by supplying energy to a region to be a non-affinity region not having an affinity to said fluid such that an affinity region having an affinity to said fluid and said non-affinity region are formed in said pattern formation region; and    immersing said base from which the metal has been selectively removed in a mixed liquid containing a sulfur compound.    
     
     
         5 . The method for manufacturing a substrate defined in  claim 3 , wherein said sulfur compound has the opposite property from that of the surface of said base in regard to affinity to said fluid.  
     
     
         6 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 masking a base that exhibits no affinity to the fluid with a mesh mask that covers the region other than a pattern formation region in which said patterned thin film is formed and also covers a non-affinity region not having an affinity to said fluid such that an affinity region having an affinity to said fluid and said non-affinity region are formed in said pattern formation region;    plasma-working said base covered with the mesh mask; and    performing a modification treatment on the base surface that has been excited by said plasma working.    
     
     
         7 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 masking a base that exhibits an affinity to the fluid with a mesh mask that covers an affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed;    plasma-working said base covered with the mesh mask; and    performing a modification treatment on the base surface that has been excited by said plasma working.    
     
     
         8 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 masking a base that exhibits no affinity to the fluid with a mesh mask that covers the region other than a pattern formation region in which said patterned thin film is formed and also covers a non-affinity region not having an affinity to said fluid such that an affinity region having an affinity to said fluid is formed within said non-affinity region in said pattern formation region; and    performing a modification treatment on said mesh-masked base by irradiating it with ultraviolet rays.    
     
     
         9 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 masking a base that exhibits an affinity to the fluid with a mesh mask that covers an affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed; and    performing a modification treatment on said mesh-masked base by irradiating it with ultraviolet rays.    
     
     
         10 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 forming a thin film from a thin film material having an affinity to said fluid on a base furnished with a surface not having an affinity to the fluid;    providing a photoresist such that an affinity region having an affinity to said fluid and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed; and    etching the base on which said photoresist has been formed and etching the region other than the region where said photoresist is provided.    
     
     
         11 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 forming a thin film from a thin film material not having an affinity to said fluid on a base furnished with a surface having an affinity to the fluid;    providing a photoresist that covers the region other than a pattern formation region for forming said patterned thin film and also covers a non-affinity region not having an affinity to said fluid such that an affinity region having an affinity to said fluid and said non-affinity region are formed in said pattern formation region; and    etching the base on which said photoresist has been formed and etching the region other than the region where said photoresist is provided.    
     
     
         12 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 applying a charge to the entire surface of a base that exhibits no affinity to the fluid;    dissipating the charge by applying energy to the region other than a pattern formation region in which said patterned thin film is formed;    dissipating the charge of a non-affinity region not having an affinity to said fluid such that an affinity region having an affinity to said fluid and said non-affinity region are formed in said pattern formation region; and    bonding a specific substance to the affinity region where the charge was not dissipated.    
     
     
         13 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the steps of: 
 applying a charge to the entire surface of a base that exhibits an affinity to the fluid;    dissipating the charge of an affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed; and    bonding a substance to the affinity region where the charge was not dissipated.    
     
     
         14 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the step of: 
 printing an affinity film in an affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in a pattern formation region in which said patterned thin film is formed on a base that exhibits no affinity to the fluid.    
     
     
         15 . A method for manufacturing a substrate for forming a patterned thin film by applying a fluid, comprising the step of: 
 printing a non-affinity film in the region other than a pattern formation region in which said patterned thin film is formed and in a disposed affinity region having an affinity to said fluid such that said affinity region and a non-affinity region not having an affinity to said fluid are formed in said pattern formation region on a base that exhibits an affinity to the fluid.    
     
     
         16 . A method of manufacturing a substrate, comprising: 
 forming a pattern formation region including a plurality of affinity regions, each having an affinity to a fluid and at least one non-affinity region not having an affinity to said fluid on a base;    wherein said affinity region and said non-affinity region are formed such that the fluid is applied continuously to said affinity region and said non-affinity region between at least two of said affinity regions.    
     
     
         17 . A method of pattern formation whereby a pattern is formed on a substrate, comprising the steps of: 
 driving an ink-jet type recording head which is able to discharge liquid droplets of said fluid in accordance with a optional pattern, and    forming a pattern with said fluid on said substrate by discharging liquid droplets of said fluid from the nozzles of said ink-jet recording head which is moving along said pattern,    wherein the substrate comprises at least one pattern formation region having a shape corresponding to the patterned film, and said pattern formation region being constituted by an affinity region having an affinity to the fluid and a non-affinity region not having an affinity to the fluid.    
     
     
         18 . A method of pattern formation as claimed in  claim 17 , wherein the formation of said pattern is achieved by discharging liquid droplets of said fluid from said nozzles by: 
 supplying said fluid to the cavities which are established in said ink-jet type recording head and which are constructed in such a way that they can be filled with said fluid, and    applying a voltage corresponding to the optional pattern to piezoelectric elements which are assembled in such a way that they produce a change in the volume of said cavities.