US2004164129A1PendingUtilityA1
Bonding tool with polymer coating
Priority: Jan 30, 2001Filed: Feb 25, 2004Published: Aug 26, 2004
Est. expiryJan 30, 2021(expired)· nominal 20-yr term from priority
H10W 72/07141B23K 20/004H10W 72/07232B23K 2101/32
34
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Claims
Abstract
A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A bonding tool for bonding a wire to a substrate, the bonding tool having a body and a working tip coupled to one end of the body, and comprising:
an orifice extending along a longitudinal axis of the body and the working tip; and a coating disposed over at least a portion of a surface of the orifice.
2 . A capillary bonding tool according to claim 1 , wherein the coating extends along an entire length of the orifice.
3 . A capillary bonding tool according to claim 2 , wherein the coating is applied to at least a portion of an exterior surface of the working tip.
4 . A capillary bonding tool according to claim 1 , wherein the coating is disposed over at least a portion of an exterior surface of the working tip.
5 . A capillary bonding tool according to claim 1 , wherein the coating is disposed over an exterior surface of the working tip and the body.
6 . A capillary bonding tool according to claim 1 , wherein the coating is a polymer.
7 . A capillary bonding tool according to claim 1 , wherein the coating is at least one of i) a polymer, ii) an Alumina, iii) Si 3 N 4 iv) silica v) a combination of 12% silica and 88% Alumina, and vi) Diamond like Silica (DLC).
8 . A capillary bonding tool according to claim 1 , wherein the coating is a polymer disposed along an interior surface of the orifice and one of i) an Alumina, ii) Si 3 N 4 , iii) silica, iv) a combination of 12% silica and 88% Alumina, and v) Diamond like Silica (DLC) disposed along an exterior portion of the orifice.
9 . A capillary bonding tool according to claim 1 , wherein the coating has a substantially uniform thickness.
10 . A capillary bonding tool according to claim 1 , wherein the coating has a substantially uniform thickness of up to about 2.0 microns.
11 . A capillary bonding tool according to claim 1 , wherein the coating has a substantially uniform thickness of about 0.1 microns.
12 . A capillary bonding tool according to claim 1 , wherein the body of the bonding tool has a substantially cylindrical shape.
13 . A capillary bonding tool according to claim 1 , wherein the coating is one of polyolefine and parylene.
14 . A capillary bonding tool according to claim 1 , wherein the coating is formed by vapor phase deposition.
15 . A capillary bonding tool according to claim 1 , wherein the coating is formed by one of chemical vapor deposition and physical vapor deposition.
16 . A capillary bonding tool according to claim 1 , wherein the coating is formed by immersing the bonding tool in a coating material.
17 . A method of manufacturing a capillary bonding tool for bonding a fine wire to a substrate, the method comprising the steps of:
forming a cylindrical body; forming a taper at a first end of the body; forming an orifice extending along a longitudinal axis of the body; and coating at least a portion of the orifice with a polymer.
18 . The method according to claim 17 , wherein the coating step forms a substantially uniform continuous coating having a thickness of up to about 2.0 microns.
19 . The method according to claim 17 , wherein the coating step forms a substantially uniform continuous coating having a thickness of at least about 0.1 micron.
20 . The method according to claim 17 , wherein the coating step comprises the steps of:
forming a precursor monomer at a first temperature and a first pressure; and forming the coating from the precursor monomer at a second temperature and pressure.
21 . The method according to claim 20 , wherein
the first temperature is about 690° C., the first pressure is about 0.5 torr, the second temperature is about 25° C., and the second pressure is about 0.1 torr.
22 . The method according to claim 20 , wherein the precursor monomer is formed from a di-Para-Xylyene dimer vaporized at about 150° C. and about 1.0 torr followed by a pyrolesis at about 690° C. and about 0.5 torr.
23 . The method according to claim 17 , wherein the capillary is formed by i) one of direct ceramic dye pressing and ii) injection molding, and machined to a final shape by one of i) grinding and ii) Electro discharge machining.
24 . A bonding tool for bonding a wire to a substrate, comprising:
a body portion; a working tip coupled to one end of the body; an orifice extending along a longitudinal axis of the body and the working tip; a first coating disposed over at least a portion of a surface of the orifice; and a second coating disposed over at least a portion of an exterior surface of the body.
25 . A capillary bonding tool according to claim 24 , wherein the first coating is a polymer and the second coating is other than a polymer.
26 . A capillary bonding tool according to claim 25 , wherein the second coating is one of an alumina and Si 3 N 4 .
27 . A method of manufacturing a capillary bonding tool for bonding a fine wire to a substrate, the method comprising the steps of:
forming an orifice extending along a longitudinal axis of the bonding tool; coating at least a portion of the orifice with a polymer; and coating at least a portion of an exterior surface of the bonding tool with a non-polymer coating.Join the waitlist — get patent alerts
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