US2004163403A1PendingUtilityA1

Apparatus and method for cooling electronic systems

36
Assignee: SUN MICROSYSTEMS INCPriority: Feb 21, 2003Filed: Feb 21, 2003Published: Aug 26, 2004
Est. expiryFeb 21, 2023(expired)· nominal 20-yr term from priority
Inventors:Ali Monfarad
H05K 7/20809F25B 1/00F25D 2500/02F25D 19/00F25B 2400/076F25B 2400/073
36
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method and apparatus for cooling electronic systems includes a field and/or customer replaceable packaged refrigeration module coupled to tubing formed in, or on, the chassis of the electronic system. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The coupling of the field replaceable packaged refrigeration module to tubing formed in or on the chassis of the electronic system serves to create a cooling system wherein the temperature of the air surrounding the electronic system is lowered and the chassis of the electronic system itself becomes a refrigerator system for the electronic components therein.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A cooling system for an electronic device comprising: 
 an electronic device chassis, said electronic device chassis comprising tubing formed into a tubing loop within said electronic device chassis;    a packaged refrigeration module, said packaged refrigeration module comprising:    a packaged refrigeration module housing;    refrigerant;    a compressor;    a condenser; and    an expansion device; wherein,    said compressor, said condenser, and said expansion device of said packaged refrigeration module and said tubing loop of said electronic device chassis are coupled together in a refrigeration loop within said electronic device chassis.    
     
     
         2 . The cooling system for an electronic device of  claim 1;  wherein, 
 said packaged refrigeration module has a width of approximately  4  inches, a length of approximately 5 inches and a height of approximately 1.75 inches.  
 
     
     
         3 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a single piston linear compressor.  
 
     
     
         4 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a dual-piston linear compressor.  
 
     
     
         5 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a multi-piston linear compressor.  
 
     
     
         6 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a rotary compressor.  
 
     
     
         7 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a reciprocating compressor.  
 
     
     
         8 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a rolling piston compressor.  
 
     
     
         9 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a rotary vane compressor.  
 
     
     
         10 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a screw compressor.  
 
     
     
         11 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a swash-plate compressor.  
 
     
     
         12 . The cooling system for an electronic device of  claim 1;  wherein, 
 said compressor is a scroll compressor.  
 
     
     
         13 . A cooling system for an electronic device comprising: 
 an electronic device chassis, said electronic device chassis comprising at least one roll-bond evaporator panel forming at least a portion of said electronic device chassis;    a packaged refrigeration module, said packaged refrigeration module comprising:    a packaged refrigeration module housing;    refrigerant;    a compressor;    a condenser; and    an expansion device; wherein,    said compressor, said condenser, and said expansion device of said packaged refrigeration module and said at least one roll-bond evaporator panel forming at least a portion of said electronic device chassis are coupled together in a refrigeration loop within said electronic device chassis.    
     
     
         14 . The cooling system for an electronic device of  claim 13;  wherein, 
 said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.  
 
     
     
         15 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a single piston linear compressor.  
 
     
     
         16 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a dual-piston linear compressor.  
 
     
     
         17 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a multi-piston linear compressor.  
 
     
     
         18 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a rotary compressor.  
 
     
     
         19 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a reciprocating compressor.  
 
     
     
         20 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a rolling piston compressor.  
 
     
     
         21 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a rotary vane compressor.  
 
     
     
         22 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a screw compressor.  
 
     
     
         23 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a swash-plate compressor.  
 
     
     
         24 . The cooling system for an electronic device of  claim 13;  wherein, 
 said compressor is a scroll compressor.  
 
     
     
         25 . A blade-cooling system, said blade-cooling system comprising: 
 a blade-cooling system housing;    refrigerant;    a compressor;    a condenser;    an expansion device; and    an evaporator; wherein,    said compressor, said condenser, and said expansion device and said evaporator of said blade-cooling system are coupled together in a refrigeration loop within said blade-cooling system housing; further wherein;    said blade-cooling system housing is sized such that said blade-cooling system fits within a blade server station in a blade server frame.    
     
     
         26 . The blade-cooling system of  claim 25;  wherein, 
 said blade-cooling system housing has a width of less than three inches, a length of less than approximately six inches and a height of less than six inches.  
 
     
     
         27 . The blade-cooling system of  claim 25;  wherein, 
 said compressor is a single piston linear compressor.  
 
     
     
         28 . The blade cooling of  claim 25;  wherein, 
 said compressor is a dual-piston linear compressor.  
 
     
     
         29 . The blade cooling of  claim 25;  wherein, 
 said compressor is a multi-piston linear compressor.  
 
     
     
         30 . The blade cooling of  claim 25;  wherein, 
 said compressor is a rotary compressor.  
 
     
     
         31 . The blade-cooling system of  claim 25;  wherein, 
 said compressor is a reciprocating compressor.  
 
     
     
         32 . The blade cooling of  claim 25;  wherein, 
 said compressor is a rolling piston compressor.  
 
     
     
         33 . The blade cooling of  claim 25;  wherein, 
 said compressor is a rotary vane compressor.  
 
     
     
         34 . The blade-cooling system of  claim 25;  wherein, 
 said compressor is a screw compressor.  
 
     
     
         35 . The blade-cooling system of  claim 25;  wherein, 
 said compressor is a swash-plate compressor.  
 
     
     
         36 . The blade-cooling system of  claim 25;  wherein, 
 said compressor is a scroll compressor.

Join the waitlist — get patent alerts

Track US2004163403A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.