Chemical mechanical polishing atomizing rinse system

Abstract

A substrate polishing system includes a delivery arm having a nozzle configured to combine a rinse fluid and a gas into an atomized spray, and to direct the atomized spray toward a polishing pad. The atomization process causes droplets of the rinse agent in the atomized spray to become negatively charged. The negative charge causes in the rinse agent to adhere to waste particles and slurry, which facilitates removal thereof from the polishing pad.

We claim:  
     
         1 . A substrate polishing system, comprising: 
 a substrate carrier;    a polishing pad; and    a delivery arm having a nozzle configured to combine a rinse fluid and a gas into an atomized spray, and to direct the atomized spray toward the polishing pad.    
     
     
         2 . The system of  claim 1 , further comprising a bracket coupled to the delivery arm for positioning the deliver arm adjacent to the polishing pad such that the atomized spray impacts the polishing pad at an angle between twenty and sixty degrees.  
     
     
         3 . The system of  claim 1 , wherein the delivery arm comprises a manifold containing delivery channels, the nozzle being coupled to the manifold delivery channels.  
     
     
         4 . The system of  claim 1 , wherein the delivery arm has a plurality of nozzles, each nozzle configured to combine a rinse fluid and a gas into an atomized spray, and to direct the atomized spray toward the polishing pad.  
     
     
         5 . The system of  claim 3 , wherein the manifold comprises a fluid deliver channel for receiving the rinse fluid and delivering the rinse fluid to the nozzle, and a gas deliver channel for receiving the gas and delivering the gas to the nozzle.  
     
     
         6 . The system of  claim 3 , wherein the manifold consists essentially of of polyethylene terephthalate.  
     
     
         7 . The system of  claim 1 , wherein the nozzle consists essentially of polyethylene terephthalate.  
     
     
         8 . A substrate polishing method, comprising the steps of: 
 supporting a substrate above a polishing pad;    dispensing slurry onto the polishing pad;    polishing the substrate against the polishing pad;    atomizing a rinse fluid with a gas in a delivery arm; and    directing the atomized rinse fluid toward the polishing pad.    
     
     
         9 . The method of  claim 8 , wherein the step of atomizing the rinse fluid includes delivering pressurized rinse fluid to the delivery arm.  
     
     
         10 . The method of  claim 8 , wherein the step of atomizing the rinse fluid includes delivering gas to the delivery arm.  
     
     
         11 . The method of  claim 10 , wherein the step of delivering pressurized rinse fluid includes pressurizing the rinse fluid to between about twenty and forty PSI.  
     
     
         12 . The method of  claim 8 , wherein the step of atomizing the rinse fluid includes delivering pressurized gas to the delivery arm.  
     
     
         13 . The method of  claim 12 , wherein the step of delivering pressurized gas includes pressurizing the gas to between about thirty and fifty PSI.  
     
     
         14 . The method of  claim 8 , wherein the step of atomizing the rinse fluid includes delivering water the delivery arm.  
     
     
         15 . The method of  claim 14 , wherein the step of atomizing the rinse fluid includes de-ionizing the water.  
     
     
         16 . The method of  claim 8 , wherein the step of atomizing the rinse fluid includes delivering air to the delivery arm.  
     
     
         17 . The method of  claim 8 , wherein the step of polishing the substrate against the polishing pad includes polishing the substrate against a rotary polishing pad.  
     
     
         18 . The method of  claim 8 , wherein the step of polishing the substrate against the polishing pad includes polishing the substrate against a linear polishing pad.  
     
     
         19 . The method of  claim 8 , wherein the step of atomizing the rinse fluid includes atomizing the rinse fluid with the gas in a plurality of delivery arms.  
     
     
         20 . A substrate polishing system, comprising: 
 a substrate carrier;    a polishing pad;    a means for combining a rinse fluid and a gas into an atomized spray; and    a means for directing the atomized spray toward the polishing pad.