Electroless plating apparatus and method

Abstract

An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having a heating portion for holding a material to be plated in such a state that a surface to be plated faces downward, and a plating bath for introducing an electroless plating liquid having a predetermined temperature into a plating chamber, and holding the electroless plating liquid while allowing the electroless plating liquid to overflow an overflow dam. The material which is by the holding portion, is brought into contact with the plating liquid in the plating bath to plate the material.

What is claimed is:  
     
         1 . An electroless plating method comprising: 
 facing a surface, to be plated, of a substrate downwardly; and    processing said surface to be plated by bringing said surface to be plated into contact with an electroless plating treatment liquid.    
     
     
         2 . An electroless plating method according to  claim 1 , wherein gas generated on said surface to be plated is removed from said surface to be plated by bringing said surface to be plated into contact with said electroless plating treatment liquid in such a state that said surface to be plated is inclined.  
     
     
         3 . An electroless plating method according to  claim 1 , wherein gas generated on said surface to be plated is removed from said surface to be plated by forming a flow of said electroless plating treatment liquid in a certain direction on said surface to be plated and entraining said gas generated on said surface to be plated with said flow of said electroless plating treatment liquid.