US2004157021A1PendingUtilityA1
Curable hot melt adhesive for casemaking
Priority: Apr 27, 2001Filed: Feb 9, 2004Published: Aug 12, 2004
Est. expiryApr 27, 2021(expired)· nominal 20-yr term from priority
Y10T428/1352Y10S156/908C09J 153/02B42D 3/02Y10T428/24479B42C 9/0006
35
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A curable casemaking adhesive, books and related articles bound thereby. In one embodiment, a UV curable hot melt adhesive is used to form the case, which is preferably also embossed. In another embodiment, a moisture curable hot melt adhesive is used to form the case, which is preferably also embossed.
Claims
exact text as granted — not AI-modified1 . A case for a hard cover book comprising a curable hot melt adhesive.
2 . The case of claim 1 wherein the case comprises a radiation curable hot melt adhesive.
3 . The case of claim 2 wherein the radiation curable hot melt adhesive is a UV curable hot melt adhesive.
4 . The case of claim 1 wherein the case comprises a moisture curable hot melt adhesive.
5 . The case of claim 1 wherein the adhesive comprises at least one block copolymer comprising a high vinyl styrene-butadiene-styrene block copolymer and a photoinitiator.
6 . The case of claim 1 wherein the block copolymer is a radial block copolymer.
7 . The case of claim 1 wherein the block copolymer is a linear block copolymer.
8 . The case of claim 1 wherein the adhesive comprises a mono epoxidized mono hydrated diene polymer and a photoinitiator.
9 . The case of claim 1 which is embossed.
10 . The case of claim 1 comprising cover boards and a porous cover stock.
11 . An embossed product comprising a cured hot melt adhesive.
12 . The product of claim 11 wherein the cured hot melt adhesive is a radiation cured hot melt adhesive.
13 . The product of claim 11 wherein the cured hot melt adhesive is a moisture cured hot melt adhesive.
14 . A method of forming a case for a hard cover book comprising bonding cover boards to cover stock material using a curable hot melt adhesive.
15 . The method of claim 14 wherein the curable adhesive is a radiation curable hot melt adhesive.
16 . The method of claim 15 wherein the radiation curable hot melt adhesive is a UV curable hot melt adhesive.
17 . The method of claim 14 wherein the curable adhesive comprises a moisture curable hot melt adhesive.
18 . The method of claim 15 wherein the adhesive comprises at least one block copolymer comprising a high vinyl styrene-butadiene-styrene block copolymer and a photoinitiator.
19 . The method of claim 18 wherein the block copolymer is a radial block copolymer.
20 . The method of claim 18 wherein the block copolymer is a linear block copolymer.
21 . The method of claim 14 wherein the adhesive comprises a mono epoxidized mono hydrated diene polymer and a photoinitiator.
22 . The method of claim 14 further comprising embossing the formed case.
23 . A method of claim 14 wherein the cover stock material is a porous cover stock material.
24 . A casemaking machine comprising a curing apparatus.
25 . The machine of claim 24 wherein the curing apparatus is the source of actinic or ionizing radiation or a source of moisture.Join the waitlist — get patent alerts
Track US2004157021A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.