US2004155668A1PendingUtilityA1
High throughput mechanical property testing of materials libraries using capacitance
Est. expiryAug 24, 2021(expired)· nominal 20-yr term from priority
Inventors:Damian HajdukEric CarlsonJ. Christopher FreitagOleg KolosovJames R. EngstromAdam SafirRavi SrinivasanLeonid Matsiev
G01N 3/18B82Y 30/00B01J 2219/0075G01N 3/10B01J 2219/00659G01N 2203/0254B01J 2219/00689B01J 2219/00596B01J 2219/00364C40B 40/14B01J 2219/00716B01J 2219/00653G01N 2203/0016B01J 2219/00373B01J 2219/00675G01N 2203/0617C40B 50/14B01J 2219/00605B01J 2219/00707B01J 2219/00754C40B 60/14B01J 2219/00274B01J 2219/00722B01J 2219/00585B01J 2219/0061B01J 2219/00677G01N 2203/0641B01J 2219/00495G01N 2203/0252B01J 2219/00621B01J 2219/00315G01N 2203/0258B01J 2219/00477G01N 2203/0623C40B 40/18B01J 2219/00691B01J 2219/00745
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Claims
Abstract
A method for high throughput mechanical property testing of materials libraries using capacitance. The method monitors the responses of a plurality of samples on a substrate to a force induced by a capacitor.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of sensing a mechanical property of a material, comprising:
providing at least one capacitor having two structures, each structure including an electrode; placing a material onto the capacitor; applying a voltage to the capacitor through the electrodes to direct a force to the material sample; monitoring a response of the material to the force with at least one response sensing device, wherein the response of the material is indicative of a mechanical property.
2 . The method of claim 1 , wherein the mechanical property is selected from the group consisting of flexure, uniaxial extension, biaxial compression, shear, stress and strain at failure, toughness, Young's modulus, complex modulus, adhesion, and combinations thereof.
3 . The method of claim 1 , wherein the mechanical property is Young's modulus.
4 . The method of claim 1 , further comprising regulating environmental conditions of the material.
5 . The method of claim 1 , wherein the at least one response sensing device is selected from the group consisting of an optical response sensing device selected from the group consisting of optical reflectance, optical interferometry, shadow illumination, and combinations thereof; an electrical response sensing device selected from the group consisting of capacitance, resistance, electromechanical switching, and combinations thereof; a wafer sensor, and combinations thereof.
6 . The method of claim 1 , further comprising securing the material to one of the structures.
7 . The method of claim 6 , wherein the material is secured onto the structure mechanically, magnetically, electromagnetically, electromechanically, chemically, or combinations thereof.
8 . The method of claim 1 , wherein the voltage is selected from the group consisting of oscillatory, non-oscillatory, and combinations thereof.
9 . The method of claim 1 , wherein the voltage is supplied by voltage supply selected from the group consisting of a variable voltage power supply, a programmable constant current source and a voltmeter, and combinations thereof.
10 . The method of claim 1 , wherein each of the materials has an area of less than about 50 mm 2 .
11 . The method of claim 1 , wherein each of the materials has a thickness of less than about 500 microns.
12 . The method of claim 1 , further comprising:
providing a plurality of capacitors; placing a library of at least four different materials onto the capacitors wherein each of the materials corresponds with one of the capacitors; applying a voltage to the structures through the electrodes to direct a force to each of the materials; and monitoring a response of each of the materials to the force with at least one response sensing device, wherein the response of the materials is indicative of a mechanical property.
13 . The method of claim 12 , wherein the method is capable of sensing a mechanical property of at least two materials of the library simultaneously.
14 . The method of claim 12 , wherein the method is capable of sensing a mechanical property of at least twenty-four materials of the library simultaneously.
15 . The method of claim 12 , wherein screening throughput rate of the library is no greater than about ten minutes.
16 . The method of claim 12 , wherein the force is applied to each of the materials in sequential order and screening throughput rate is no greater than 10 minutes per material.
17 . The method of claim 12 , wherein the mechanical property is selected from the group consisting of flexure, uniaxial extension, biaxial compression, shear, stress and strain at failure, toughness, Young's modulus, complex modulus, adhesion, and combinations thereof.
18 . The method of claim 17 , wherein the mechanical property is Young's modulus.
19 . The method of claim 12 , each of the materials is secured on a surface of one of the structures that forms each of said capacitors.
20 . The method of claim 12 , wherein each of the materials has an area of less than about 50 mm 2 .
21 . The method of claim 12 , wherein each of the materials has a thickness of less than about 500 microns.Join the waitlist — get patent alerts
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