Method for manufacturing digital micro-mirror device (DMD)

Abstract

A method for manufacturing a semiconductor package is disclosed. A wafer including a plurality of semiconductor chips is provided. Each chip has one or more mirrors mounted thereon. Further, a plurality of bond pads formed on a periphery of the chip. Next, a photoresist is formed over the one or more mirrors. Then, the semiconductor chips are singulated from the wafer. One ore more semiconductor chips are mounted on a base substrate. The bond pads of the semiconductor chip are electrically connected with the base substrate. The photoresist is then removed from the semiconductor chips.

What is claimed is:  
     
         1 . A digital micro-mirror device (DMD) packages, comprising: 
 a base substrate having a top surface and a bottom surface;    a metallic layer formed on the top surface of the base substrate;    a metallic adhesive formed on the metallic layer;    a semiconductor chip mounted on the metallic adhesive, the base substrate electrically connected with the semiconductor chip;    one or more mirrors mounted on the semiconductor chip;    a hermetic sealing means covering the semiconductor chip including the one more mirrors.    
     
     
         2 . The DMD package of  claim 1 , which further comprises a heat sink attached on the bottom surface of the base substrate.