US2004149490A1PendingUtilityA1

Coaxial via hole and process of fabricating the same

41
Priority: Aug 11, 2000Filed: Jan 23, 2004Published: Aug 5, 2004
Est. expiryAug 11, 2020(expired)· nominal 20-yr term from priority
Inventors:Huey-Ru ChangMin-Lin LeeTed Ho
H05K 1/167H05K 1/0222H05K 1/141H05K 2201/10378H05K 3/429H05K 2201/10689H05K 3/4069H05K 2201/09809H05K 1/115H05K 1/162H10W 72/07251H10W 72/20H10W 44/212H10W 70/635H10W 70/65
41
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Claims

Abstract

A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A coaxial via hole used in a carrier, comprising: 
 an outer cylinder-shaped conductor extending along a first direction;    an inner cylinder-shaped conductor in the outer cylinder-shaped conductor, wherein the inner cylinder-shaped conductor extends along the first direction; and    an insulating fill between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor.    
     
     
         2 . The coaxial via hole as claimed in  claim 1 , wherein the first direction is vertical to a direction along which the carrier extends.  
     
     
         3 . The coaxial via hole as claimed in  claim 1 , wherein the carrier is a printed circuit board (PCB).  
     
     
         4 . The coaxial via hole as claimed in  claim 1 , wherein the carrier is a substrate.  
     
     
         5 . The coaxial via hole as claimed in  claim 1 , wherein the carrier is an Integrated Circuit (IC) socket.  
     
     
         6 . The coaxial via hole as claimed in  claim 1 , wherein the carrier is an adapter.  
     
     
         7 . The coaxial via hole as claimed in  claim 1 , wherein the carrier is a connector.  
     
     
         8 . The coaxial via hole as claimed in  claim 1 , wherein the carrier is a heat sink.  
     
     
         9 . The coaxial via hole as claimed in  claim 1 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates a portion of the carrier.  
     
     
         10 . The coaxial via hole as claimed in  claim 1 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates the carrier.  
     
     
         11 . The coaxial via hole as claimed in  claim 1 , wherein a cross section, in a direction vertical to the first direction, of the outer cylinder-shaped conductor can shape as any configuration and wherein a cross section, in the direction vertical to the first direction, of the inner cylinder-shaped conductor can shape as any configuration.  
     
     
         12 . The coaxial via hole as claimed in  claim 1 , the inner cylinder-shaped conductor is connected to a negative voltage source.  
     
     
         13 . The coaxial via hole as claimed in  claim 1 , the inner cylinder-shaped conductor is connected to a positive voltage source.  
     
     
         14 . The coaxial via hole as claimed in  claim 1 , the inner cylinder-shaped conductor is connected to a signal conductor.  
     
     
         15 . The coaxial via hole as claimed in  claim 1 , the outer cylinder-shaped conductor is connected to a negative voltage source.  
     
     
         16 . The coaxial via hole as claimed in  claim 1 , the outer cylinder-shaped conductor is connected to a positive voltage source.  
     
     
         17 . The coaxial via hole as claimed in  claim 1 , the outer cylinder-shaped conductor is connected to a signal conductor.  
     
     
         18 . The coaxial via hole as claimed in  claim 1 , further comprising: 
 a conductor which is connected to the inner cylinder-shaped conductor and is connected to a negative voltage source.    
     
     
         19 . The coaxial via hole as claimed in  claim 1 , further comprising: 
 a conductor which is connected to the inner cylinder-shaped conductor and is connected to a positive voltage source.    
     
     
         20 . The coaxial via hole as claimed in  claim 1 , further comprising: 
 a conductor which is connected to the inner cylinder-shaped conductor and is connected to a signal conductor.    
     
     
         21 . The coaxial via hole as claimed in  claim 1 , further comprising 
 a conductor which is connected to the outer cylinder-shaped conductor and is connected to a negative voltage source .    
     
     
         22 . The coaxial via hole as claimed in  claim 1 , further comprising 
 a conductor which is connected to the outer cylinder-shaped conductor and is connected to a positive voltage source.    
     
     
         23 . The coaxial via hole as claimed in  claim 1 , further comprising 
 a conductor which is connected to the outer cylinder-shaped conductor and is connected to a signal conductor.    
     
     
         24 . The coaxial via hole as claimed in  claim 1 , wherein the insulating fill is made of a material with high dielectric constant.  
     
     
         25 . A method of manufacturing a coaxial via hole, comprising: 
 (a) forming a first hole in a carrier;    (b) making the interior of the first hole conduct electricity to form an outer cylinder-shaped conductor;    (c) placing an insulating material in the outer cylinder-shaped conductor to form an insulating fill;    (d) forming a second hole in the insulating fill, wherein the second hole has a diameter smaller than the diameter of the first hole; and    (e) making the interior of the second hole conduct electricity to form an inner cylinder-shaped conductor.    
     
     
         26 . The method of manufacturing a coaxial via hole as claimed in  claim 25 , wherein in said step (b), making the interior of the first hole become conduct electricity to form an outer cylinder-shaped conductor by plating.  
     
     
         27 . The method of manufacturing a coaxial via hole as claimed in  claim 25  or  26 , wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by plating.  
     
     
         28 . The method of manufacturing a coaxial via hole as claimed in  claim 25  or  26 , wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by placing conductive paste.  
     
     
         29 . The method of manufacturing a coaxial via hole as claimed in  claim 25 , wherein in said step (c), the insulating material is filled in the outer cylinder-shaped conductor by plugging.  
     
     
         30 . The method of manufacturing a coaxial via hole as claimed in  claim 25 , wherein in said step (c), the insulating material is filled in the outer cylinder-shaped conductor by laminating.  
     
     
         31 . A coaxial via hole used in a carrier, comprising: 
 an outer cylinder-shaped conductor extending along a first direction;    an inner cylinder-shaped conductor in the outer cylinder-shaped conductor, wherein the inner cylinder-shaped conductor extends along the first direction; and    an electrical-resistant fill between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor.    
     
     
         32 . The coaxial via hole as claimed in  claim 31 , further comprising: 
 a conductor which is connected to the outer cylinder-shaped conductor and is connected to a signal conductor.    
     
     
         33 . The coaxial via hole as claimed in  claim 31 , further comprising: 
 a conductor which is connected to the outer cylinder-shaped conductor and is connected to positive voltage source.    
     
     
         34 . The coaxial via hole as claimed in  claim 31 , further comprising: 
 a conductor which is connected to the outer cylinder-shaped conductor and is connected to a negative source.    
     
     
         35 . The coaxial via hole as claimed in  claim 31 , further comprising: 
 a conductor which is connected to the inner cylinder-shaped conductor and is connected to a signal conductor.    
     
     
         36 . The coaxial via hole as claimed in  claim 31 , further comprising: 
 a conductor which is connected to the inner cylinder-shaped conductor and is connected to a positive voltage source.    
     
     
         37 . The coaxial via hole as claimed in  claim 31 , further comprising: 
 a conductor which is connected to the inner cylinder-shaped conductor and is connected to a negative voltage source.    
     
     
         38 . The coaxial via hole as claimed in  claim 31 , wherein the carrier is a PCB.  
     
     
         39 . The coaxial via hole as claimed in  claim 31 , wherein the carrier is a substrate.  
     
     
         40 . The coaxial via hole as claimed in  claim 31 , wherein the carrier is an IC socket.  
     
     
         41 . The coaxial via hole as claimed in  claim 31 , wherein the carrier is an adapter.  
     
     
         42 . The coaxial via hole as claimed in  claim 31 , wherein the carrier is a connector.  
     
     
         43 . The coaxial via hole as claimed in  claim 31 , wherein the carrier is a heat sink.  
     
     
         44 . The coaxial via hole as claimed in  claim 31 , wherein the first direction is vertical to a direction along which the carrier extends.  
     
     
         45 . The coaxial via hole as claimed in  claim 31 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates a portion of the carrier.  
     
     
         46 . The coaxial via hole as claimed in  claim 31 , wherein the carrier at least comprises a conductive layer and the coaxial via hole penetrates the carrier.  
     
     
         47 . A method of manufacturing a coaxial via hole, comprising: 
 (a) forming a first hole in a carrier;    (b) making the interior of the first hole become conduct electricity to form an outer cylinder-shaped conductor;    (c) placing an electrical-resistant material in the outer cylinder-shaped conductor to form an electrical-resistant fill;    (d) forming a second hole in the electrical-resistant region, wherein the second hole has a diameter smaller than the diameter of the first hole; and    (e) making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor.    
     
     
         48 . The method of manufacturing a coaxial via hole as claimed in  claim 47 , wherein in said step (b), making the interior of the first hole become conduct electricity to form an outer cylinder-shaped conductor by plating.  
     
     
         49 . The method of manufacturing a coaxial via hole as claimed in  claim 47  or  48 , wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by plating.  
     
     
         50 . The method of manufacturing a coaxial via hole as claimed in  claim 47  or  48 , wherein in said step (e), making the interior of the second hole become conduct electricity to form an inner cylinder-shaped conductor by placing conductive paste.

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