System and method of producing wafer

Abstract

A system and method of manufacturing wafers are provided suitable for a semiconductor manufacturing system and a method thereof capable of shortening the processing period composed of a series of processes applied to objects to be processed, mainly carry out processes and conveyance peace by peace, and which can manufacture even various kings of products. The system is provided with a plurality of processing units each having therein a conveying mechanism, and is provided therein with a conveyer device for conveying the objects to be processed to the processing units. Further, the conveyer device includes loader conveying means which is laid along object transferring ports of the plurality of processing units across the object transferring ports of not less than two of the processing units, and a running robot which runs across not less than two of the object transferring ports, and a transferring robot for transferring the objects to be processed from the running robot to the processing units through the transferring ports, are arranged in the loader means. The loader means is shielded and provided with a purifying device so as to define an atmospheric pressure space conveying path.

What is claimed is:  
     
         1 : A wafer manufacturing method for use in a wafer manufacturing apparatus comprising a plurality of processing units each having therein at least one processing chamber, a conveying mechanism, and a conveyer device for conveying objects to be processed to the processing units in an atmospheric pressure space which is arranged in an atmospheric air, and provided therein a purifying device, comprising the steps of: 
 temporarily holding objects to be processed in a container to introduce or deliver individual object to be processed;    transferring the objects to be processed between the container and the conveyer device;    conveying an object to be processed to a position around a desired one of the plurality of processing units through an atmospheric pressure space conveying path in the conveyer device,    transferring the object to be processed between the desired processing unit and the conveyer device with a designated timing;    processing the objects to be processed, via the plurality of processing units; and    transferring the objects to be processed between the processing units through the atmospheric pressure conveying path.    
     
     
         2 : A wafer manufacturing method as claimed in  claim 1 , further comprising a step of transferring objects to be processed piece-by-piece between the desired processing unit, a storage device or a measuring device and the conveying mechanism with a timing which is different among the processing units, the storage device and the measuring device.  
     
     
         3 : A wafer manufacturing method as claimed in  claim 1 , further comprising a step of temporarily accommodating the objects to be processed in the conveyer device between the steps of receiving the objects to be processed from the processing units to the conveyer device and the step of delivering the objects to be processed from the conveyer device to the processing units.  
     
     
         4 : A wafer manufacturing method as claimed in  claim 2 , further comprising a step of temporarily accommodating the objects to be processed in the conveyer device between the steps of receiving the objects to be processed from the processing units to the conveyer device and the step of delivering the objects to be processed from the conveyer device to the processing units.