US2004145035A1PendingUtilityA1

Signal transmission plate used in an assembly package

37
Priority: Jan 31, 2002Filed: Jan 13, 2004Published: Jul 29, 2004
Est. expiryJan 31, 2022(expired)· nominal 20-yr term from priority
Inventors:Chaur-Chin Yang
H10W 90/754H10W 90/734H10W 90/732H10W 90/724H10W 90/722H10W 90/291H10W 74/00H10W 72/5522H10W 72/884H10W 72/877H10W 72/865H10W 72/859H10W 72/856H10W 74/117H10W 74/15H10W 74/012H10W 90/00
37
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Claims

Abstract

A signal transmission plate used in an assembly package includes at least one insulating layer, at least one layout wire layer formed on the insulating layer, and a solder mask layer formed on the layout wire layer. The solder mask layer exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A signal transmission plate used in an assembly package having a die, a plurality of conductive wires, and a substrate, the signal transmission plate comprising: 
 at least one insulating layer;    at least one layout wire layer formed on the insulating layer; and    a solder mask layer formed on the layout wire layer, wherein the solder mask layer exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads.    
     
     
         2 . The signal transmission plate as claimed in  claim 1 , wherein the die is electrically connected with the die bonding pads, the wire bonding pads are electrically connected with the substrate via the conductive wires.  
     
     
         3 . The signal transmission plate as claimed in  claim 1 , wherein the layout wire layer is formed by patterning a metal foil.  
     
     
         4 . The signal transmission plate as claimed in  claim 1 , wherein the metal foil is a copper foil.  
     
     
         5 . The signal transmission plate as claimed in  claim 1 , wherein the insulating layer is formed of bismaleimide triazine (BT).  
     
     
         6 . The signal transmission plate as claimed in  claim 1 , wherein the insulating layer is formed of glass epoxy.

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