Chip transporter

Abstract

Apparatus for transporting semiconductor chips defining electronic circuitry or the like including a base layer of deformable anti-static film; a thin plastic body layer having a first surface to which the base layer adheres, the body layer having one or more cavities shaped to hold chips; and an anti-static holding layer adhering to a surface of the body layer opposite the base layer, the holding layer being less deformable than the base layer and provided with openings through which a chip defining electronic circuitry or the like may be inserted into one of the cavities and will be held in place therein by the holding layer.

What is claimed is:  
     
         1 . A protective carrier for electronic circuitry on a semiconductor chip comprising a base layer of deformable anti-static film; a thin plastic body layer halving a first surface to which the base layer adheres, the body layer having a cavity shaped to hold a semiconductor chip; and an anti-static holding layer adhering to a surface of the body layer opposite the base layer, the holding layer being less deformable than the base layer and provided with an opening through which a chip may be inserted into the cavity to be held in place therein by the holding layer.  
     
     
         2 . A protective carrier for electronic circuitry on a generally-flat semiconductor chip comprising a stiff layer of material defining a volume into which the chip may be placed, a generally-flat distendable surface of anti-static material larger than a largest flat surface of the chip adhering to the stiff layer of material and closing the volume on one side, and a generally-flat layer of anti-static material larger than a largest flat surface of the chip adhering to the stiff layer of material at a side opposite the one side, the last-mentioned generally-flat layer of anti-static material having an opening through which the chip may be inserted into the volume and removed.  
     
     
         3 . A protective carrier for electronic circuitry on a generally-flat semiconductor chip comprising a stiff layer of material defining a volume into which the chip may be placed, a generally-flat surface of anti-static material larger than a largest flat surface of the chip adhering to the stiff layer of material and closing the volume on one side, a generally-flat layer of anti-static material larger than a largest flat surface of the chip adhering to the stiff layer of material to effectively close the volume at a side opposite the one side, and means providing an opening through which the chip may be inserted into the volume and removed.