US2004137359A1PendingUtilityA1

Positive photoresist composition

Assignee: TOKYO OHKA KOGYO CO LTDPriority: Jan 17, 2001Filed: Dec 23, 2003Published: Jul 15, 2004
Est. expiryJan 17, 2021(expired)· nominal 20-yr term from priority
G03F 7/022G03F 7/0226G03F 7/039
42
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Claims

Abstract

A composition includes (A) an alkali-soluble resin, (B) a quinonediazide ester of a compound represented by the following formula: and (C) a compound represented by the following formula: This composition is a positive photoresist composition that is excellent in sensitivity and definition and causes less shrink.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A positive photoresist composition comprising; 
 (A) an alkali-soluble resin;    (B) a photosensitizer comprising a quinonediazide ester between a naphthoquinonediazidosulfonic acid compound and a compound represented by following Formula (I):                           wherein R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7  and R 8  are each independently a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms, and    (C) a sensitizer comprising at least one of compounds represented by following Formula (III):                           wherein x is 0 or 1.    
     
     
         2 . The positive photoresist composition according to  claim 1 , wherein the compound represented by Formula (I) is a compound represented by the following formula:  
       
         
           
           
               
               
           
         
       
     
     
         3 . The positive photoresist composition according to  claim 1 , wherein the compound represented by Formula (III) is a compound represented by the following formula:  
       
         
           
           
               
               
           
         
       
     
     
         4 . The positive photoresist composition according to  claim 1 , wherein the compound represented by Formula (III) is a compound represented by the following formula:

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