US2004137359A1PendingUtilityA1
Positive photoresist composition
Est. expiryJan 17, 2021(expired)· nominal 20-yr term from priority
G03F 7/022G03F 7/0226G03F 7/039
42
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Claims
Abstract
A composition includes (A) an alkali-soluble resin, (B) a quinonediazide ester of a compound represented by the following formula: and (C) a compound represented by the following formula: This composition is a positive photoresist composition that is excellent in sensitivity and definition and causes less shrink.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A positive photoresist composition comprising;
(A) an alkali-soluble resin; (B) a photosensitizer comprising a quinonediazide ester between a naphthoquinonediazidosulfonic acid compound and a compound represented by following Formula (I): wherein R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are each independently a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms, and (C) a sensitizer comprising at least one of compounds represented by following Formula (III): wherein x is 0 or 1.
2 . The positive photoresist composition according to claim 1 , wherein the compound represented by Formula (I) is a compound represented by the following formula:
3 . The positive photoresist composition according to claim 1 , wherein the compound represented by Formula (III) is a compound represented by the following formula:
4 . The positive photoresist composition according to claim 1 , wherein the compound represented by Formula (III) is a compound represented by the following formula:Join the waitlist — get patent alerts
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