US2004134522A1PendingUtilityA1

Apparatus and method for the treatment of semiconductor wafers

Assignee: MATTSON WET PRODUCTSPriority: Apr 25, 2000Filed: Dec 10, 2003Published: Jul 15, 2004
Est. expiryApr 25, 2020(expired)· nominal 20-yr term from priority
H10P 72/0422Y10S134/902Y10S438/906H10P 72/0602H10P 72/0414
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Claims

Abstract

An apparatus for the treatment of semi-conductor wafers is provided. The apparatus has a first valve mechanism for introducing different treatment fluids into a treatment tank from different reservoirs. At least one collection device is provided for collecting a treatment fluid after treatment of wafers therewith in the treatment tank. A second valve mechanism is provided for conveying at least a portion of the treatment fluid out of the collection device and to a respective reservoir. A rinsing mechanism is provided for rinsing the collection device.

Claims

exact text as granted — not AI-modified
What we claim is:  
     
         1 . An apparatus for the treatment of semiconductor wafers, comprising: 
 a treatment tank;    a first valve mechanism for an introduction of different treatment fluids into said treatment tank from different reservoirs;    at least one collection means for collecting a treatment fluid after a treatment of wafers in said treatment tank therewith;    a second valve mechanism for conveying at least a portion of said treatment fluid out of said at least one collections means and to a respective reservoir; and    a rinsing mechanism for rinsing said at least one collection means.    
     
     
         2 . An apparatus according to  claim 1 , wherein said treatment tank is provided with a rapid discharge valve, and one of said collection means is disposed below said treatment tank.  
     
     
         3 . An apparatus according to  claim 1 , wherein said at least one collection means is embodied as an overflow collar of said treatment tank.  
     
     
         4 . An apparatus according to  claim 3 , wherein a controllable connection line is disposed between said overflow collar and one of said collection means disposed below said treatment tank.  
     
     
         5 . An apparatus according to  claim 1 , wherein said rinsing mechanism is provided with at least one fluid nozzle in said at least one collection means.  
     
     
         6 . An apparatus according to  claim 1 , wherein a control unit is provided for determining the volume of a treatment fluid in at least one of said reservoirs, wherein at least one unit is provided for determining the concentration of at least one fluid component of said treatment fluid, and wherein a control unit is provided for introducing a specified quantity of said fluid component based on the volume and concentration thereof.  
     
     
         7 . An apparatus according to  claim 1 , which further comprises at least one of a pump for circulating a treatment fluid in at least one of said reservoirs, a filter unit in at least one of said reservoirs, and a temperature control unit in at least one of said reservoirs.

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