Electronic device packaging and curable resin composition

Abstract

A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent; (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

What is claimed is:  
     
         1 . In a process for packaging an electronic device comprising the steps of: 
 preparing a printed wiring board which has wiring copper layers coated with a metal layer comprising a metal other than copper;    coating the metal layer with an insulating protective resin layer, keeping an area for mounting an electronic device exposed;    mounting the electronic device on the exposed area via an electroconductive material; and    coating the mounted electronic device and a portion of the insulating protective resin layer with an encapsulant;    an improvement in which the insulating protective resin layer is produced by employing at least one of the following resin compositions (1) to (3):    (1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent;    (2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and    (3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent.    
     
     
         2 . The process of  claim 1 , wherein the metal layer comprises tin.  
     
     
         3 . The process of  claim 1 , wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.  
     
     
         4 . The process of  claim 3 , wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.  
     
     
         5 . The process of  claim 1 , wherein the resin composition contains a curing catalyst.  
     
     
         6 . The process of  claim 1 , wherein the resin composition contains a filler.  
     
     
         7 . The process of  claim 1 , wherein the resin composition is curable at a temperature of lower than 130° C.  
     
     
         8 . A resin composition comprising a combination of 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent, or a combination of 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent.  
     
     
         9 . The resin composition of  claim 8 , wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.  
     
     
         10 . The resin composition of  claim 9 , wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.  
     
     
         11 . The resin composition of  claim 8 , which further contains a curing catalyst.  
     
     
         12 . The resin composition of  claim 8 , which further contains a filler.  
     
     
         13 . The resin composition of  claim 8 , which is curable at a temperature of lower than 130° C.  
     
     
         14 . A cured resin material which is produced by curing at least one of the following resin compositions (1) to (3) for producing: 
 (1) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 weight parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent;    (2) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 weight parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and    (3) a resin composition comprising 100 weight parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 weight parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent,    and which shows no glass transition temperature of higher than 160° C.    
     
     
         15 . The cured resin material of  claim 14 , wherein the organic solvent-soluble resin is an organic solvent-soluble polyimide-siloxane.  
     
     
         16 . The cured resin material of  claim 15 , wherein the organic solvent-soluble polyimide siloxane is produced by a reaction of a tetracarboxylic acid compound with a diamine compound comprising 30 to 95 mol. % of a diaminopolysiloxane compound, 0.5 to 40 mol. % of an aromatic diamine compound having a polar group on an aromatic ring thereof and 0 to 69.5 mol. % of an diamine compound other than the aromatic diamine compound.  
     
     
         17 . The cured resin material of  claim 14 , which further contains a curing catalyst.  
     
     
         18 . The cured resin material of  claim 14 , which further contains a filler.