Wafer processing apparatus including clean box stopping mechanism

Abstract

The semiconductor wafer processing apparatus includes a clean box having an opening, a lid for closing the opening, a door to be in contact with the lid and to detach the lid from the clean box, a first stopper adapted to move in conjunction with movement of the clean box without a change in its relative positional relationship with the clean box, and an unmoved second stopper. With this structure, it is possible to prevent the clean box moved on the semiconductor wafer processing apparatus from colliding with the apparatus, even if the clean box manufactured by molding using a reinforced plastic in accordance with a prescribed standard includes a manufacturing error in its size.

What is claimed is:  
     
         1 . A wafer processing apparatus for receiving a wafer from a clean box including a box body that has an opening portion at one side thereof and a lid for closing said opening portion, and processing said wafer, comprising: 
 a main housing having a window opening at one side thereof;    an openable/closable door for closing the window opening; and    an access plate on which the clean box is placed thereon so that the opening portion faces against to said window opening,    wherein said access plate includes a docking plate on which the clean box is substantially placed thereon, an air cylinder which supports said docking plate movably toward said main housing and is supported by said access plate, a first stopper provided on said docking plate, and a second stopper provided on said access plate, and    wherein a movement of said docking plate toward the main housing is regulated by an abutment operation of said first and second stopper.    
     
     
         2 . A wafer processing apparatus according to  claim 1 , wherein a position at which said first stopper abuts said second stopper is provided at a position shifted from a position at which the lid of the clean box placed on said docking plate abuts said door, in a direction along which said door moves from a closing position to a position for opening said window opening.  
     
     
         3 . A wafer processing apparatus according to  claim 1 , wherein said sir cylinder and said first stopper are placed at a position housed within a bore provided below said docking plate and on said access plate.  
     
     
         4 . A wafer processing apparatus according to  claim 2 , wherein said sir cylinder and said first stopper are placed at a position housed within a bore provided below said docking plate and on said access plate.