US2004124740A1PendingUtilityA1

Surface acoustic wave device

40
Assignee: MURATA MANUFACTURING COPriority: Jun 27, 2000Filed: Nov 26, 2003Published: Jul 1, 2004
Est. expiryJun 27, 2020(expired)· nominal 20-yr term from priority
Inventors:Yuichi TakamineKazunobu ShimoeShigeto Taga
H10W 90/754H10W 90/724H10W 72/932H10W 70/655H03H 9/0042H03H 9/0085H03H 9/0061H03H 9/059H03H 9/0057H03H 9/14588H03H 9/6489H03H 9/1071H03H 9/64
40
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A surface acoustic wave device includes a piezoelectric substrate, at least one IDT disposed on the piezoelectric substrate, and an input end and an output end connected to the IDT. At least one of the input end and the output end includes a pair of balanced signal terminals, and a delay line or a reactance component connected to one of the pair of balanced signal terminals.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A surface acoustic wave device comprising: 
 a piezoelectric substrate;    at least one IDT disposed on the piezoelectric substrate;    an input end and an output end connected to the IDT, at least one of the input end and the output end including a pair of balanced signal terminals; and    at least one of a delay line and a reactance component connected to one of the pair of balanced signal terminals.    
     
     
         2 . A surface acoustic wave device according to  claim 1 , wherein the surface acoustic wave device is a longitudinally coupled resonator type surface acoustic wave filter in which at least three IDTs are disposed along the surface acoustic wave propagation direction.  
     
     
         3 . A surface acoustic wave device according to  claim 2 , wherein the surface acoustic wave device includes a plurality of the longitudinally coupled resonator type surface acoustic wave filters.  
     
     
         4 . A surface acoustic wave device according to  claim 1 , wherein there is no electrically neutral point between the first and second balanced signal terminals.  
     
     
         5 . A surface acoustic wave device according to  claim 1 , further comprising a package and a microstrip line provided on one of the package and the piezoelectric substrate, wherein the microstrip line constitutes at least one of the delay line and the reactance component.  
     
     
         6 . A surface acoustic wave device according to  claim 5 , further comprising a plurality of IDTs disposed on the piezoelectric substrate and housed inside the package such that the surface of the piezoelectric substrate having the IDTs disposed thereon facing downward.  
     
     
         7 . A surface acoustic wave device according to  claim 1 , further comprising a package having electrodes disposed thereon, wherein the electrodes of the package are electrically connected to at least one of the input and output ends having the first and second balanced signal terminals via a bonding wire, and wherein the bonding wire constitutes at least one of the delay line and the reactance component.  
     
     
         8 . A communication device containing a surface acoustic wave device according to  claim 1 .  
     
     
         9 . A surface acoustic wave device comprising: 
 a piezoelectric substrate;    at least one IDT disposed on the piezoelectric substrate;    an input end and an output end connected to the IDT, at least one of the input end and the output end including a pair of balanced signal terminals; and    at least one of a plurality of delay lines and a plurality of reactance components connected to the pair of balanced signal terminals, respectively, and being different from each other.    
     
     
         10 . A surface acoustic wave device according to  claim 9 , wherein the surface acoustic wave device is a longitudinally coupled resonator type surface acoustic wave filter in which at least three IDTs are disposed along the surface acoustic wave propagation direction.  
     
     
         11 . A surface acoustic wave device according to  claim 10 , wherein the surface acoustic wave device includes a plurality of the longitudinally coupled resonator type surface acoustic wave filters.  
     
     
         12 . A surface acoustic wave device according to  claim 9 , wherein there is no electrically neutral point between the first and second balanced signal terminals.  
     
     
         13 . A surface acoustic wave device according to  claim 9 , further comprising a package and a microstrip line provided on one of the package and the piezoelectric substrate, wherein the microstrip line constitutes at least one of the delay line and the reactance component.  
     
     
         14 . A surface acoustic wave device according to  claim 13 , further comprising a plurality of IDTs disposed on the piezoelectric substrate and housed inside the package such that the surface of the piezoelectric substrate having the IDTs disposed thereon facing downward.  
     
     
         15 . A surface acoustic wave device according to  claim 9 , further comprising a package having electrodes disposed thereon, wherein the electrodes of the package are electrically connected to at least one of the input and output ends having the first and second balanced signal terminals via a bonding wire, and wherein the bonding wire constitutes at least one of the delay line and the reactance component.  
     
     
         16 . A communication device containing a surface acoustic wave device according to  claim 9 .  
     
     
         17 . A surface acoustic wave device comprising: 
 a piezoelectric substrate;    at least one IDT disposed on the piezoelectric substrate;    an input end and an output end connected to the IDT, at least one of the input end and the output end including a pair of balanced signal terminals; and    a capacitance component connected between the pair of balanced signal terminals.    
     
     
         18 . A surface acoustic wave device according to  claim 17 , wherein the surface acoustic wave device is a longitudinally coupled resonator type surface acoustic wave filter in which at least three IDTs are disposed along the surface acoustic wave propagation direction.  
     
     
         19 . A surface acoustic wave device according to  claim 18 , wherein the surface acoustic wave device includes a plurality of the longitudinally coupled resonator type surface acoustic wave filters.  
     
     
         20 . A surface acoustic wave device according to  claim 17 , wherein there is no electrically neutral point between the pair of balanced signal terminals.  
     
     
         21 . A surface acoustic wave device according to  claim 17 , further comprising a package and a microstrip line provided on one of the package and the piezoelectric substrate, wherein the microstrip line constitutes the capacitance component.  
     
     
         22 . A surface acoustic wave device according to  claim 21 , further comprising a plurality of IDTs disposed on the piezoelectric substrate and housed inside the package such that the surface of the piezoelectric substrate having the IDTs disposed thereon facing downward.  
     
     
         23 . A surface acoustic wave device according to  claim 17 , further comprising a package having electrodes disposed thereon, wherein the electrodes of the package are electrically connected to at least one of the input and output ends having the pair of balanced signal terminals via a bonding wire, and wherein the bonding wire constitutes the capacitance component.  
     
     
         24 . A communication device containing a surface acoustic wave device according to  claim 17.

Join the waitlist — get patent alerts

Track US2004124740A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.