Thermally enhanced package for an integrated circuit

Abstract

A circuit assembly having an insulating base, heat-conducting plate and circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channels that are in thermal contact with the heat-conducting plate. The die includes an integrated circuit therein and is mounted such that the heat-conducting plate is disposed between the die and the insulating plate. The insulating base preferably includes signal conducting channels for providing electrical connections to the die, the heat-conducting plate having an opening therein for making the connections between the die and the conducting channels. The assembly may also include a heat-spreading cover in thermal contact with the heat-conducting base plate, the heat-spreading cover overlying the die. The heat-conducting channels are preferably filled with solder, and include a solder protrusion extending from the heat-conducting channels.

What is claimed is:  
     
         1 . A circuit assembly comprising: 
 a heat-conducting base plate;    an insulating base; and    a die having an integrated circuit therein, said die being in thermal contact with said heat-conducting base plate, said heat-conducting plate being disposed between said die and said insulating base.    
     
     
         2 . The circuit assembly of  claim 1  wherein said insulating base further comprises a plurality of heat-conducting channels, said heat-conducting channels being in thermal contact with said heat-conducting plate.  
     
     
         3 . The circuit assembly of  claim 2  wherein said insulating base further comprises signal conducting channels for providing electrical connections to said die, said heat-conducting plate having an opening therein for making said connections between said die and said conducting channels.  
     
     
         4 . The circuit assembly of  claim 1  further comprising a heat-spreading cover in thermal contact with said heat-conducting base plate, said heat-spreading cover overlying said die.  
     
     
         5 . The circuit assembly of  claim 2  wherein said heat-conducting channels comprise solder.  
     
     
         6 . The circuit assembly of  claim 2  further comprising a solder protrusion extending from said heat-conducting channels.  
     
     
         7 . The circuit assembly of  claim 1  wherein said heat-conducting base plate comprises copper.  
     
     
         8 . The circuit assembly of  claim 1  wherein said heat-conducting plate is bonded to said insulating base.