An electronic component with a leadframe

Abstract

The invention relates to an electronic component ( 1 ) including a leadframe ( 2 ), composed of a platform ( 5 ), and possibly at least one electrical connecting piece ( 6′, 6″ ), wherein at least one electronic member ( 3 ) is located on the platform ( 5 ), and including a housing ( 4 ) that encloses the electronic member ( 3 ) and the platform ( 5 ), wherein at least one support region ( 7 ) is provided to support the platform ( 5 ) during the fabrication process for the housing ( 4 ), and wherein at least a section of the at least one support region ( 7 ) projects from the housing ( 4 ).

What is claimed is:  
     
         1 . Electronic component ( 1 ) including a leadframe ( 2 ), a platform ( 5 ) on which a electronic member ( 3 ) is located, and including a housing ( 4 ) which encloses the electronic member ( 3 ) and the platform ( 5 ), wherein at least one support region ( 7 ) is provided on the platform ( 5 ) to support the platform during the fabrication process for the housing, and that a section of the at least one support region ( 7 ) projects from the housing ( 4 ).  
     
     
         2 . Electronic component according to  claim 1 , wherein the at least one support region ( 7 ) is in the form of a lobe element ( 7 ) molded onto the platform ( 5 ).  
     
     
         3 . Electronic component according to  claim 2  wherein a plurality of lobe elements ( 7 ) are molded onto the platform ( 5 ).  
     
     
         4 . The electronic component of  claim 3 , wherein at least one lobe element ( 7 ) is molded onto the platform ( 5 ), forming a single piece.  
     
     
         5 . The electronic component of  claim 4 , wherein at least one notch-shaped depression ( 10 ) is provided along the transition zone between the support region or lobe element ( 7 ) and the platform ( 5 ).  
     
     
         6 . The electronic component of  claim 5 , wherein that a connecting piece ( 6 ′) is molded onto the platform ( 5 ).  
     
     
         7 . The electronic component of  claim 6 , that at least one connecting piece ( 6 ′) is molded onto the platform ( 5 ) forming a single piece.  
     
     
         8 . The electronic component of  claim 7 , wherein at least three connecting pieces ( 6 ′,  6 ″) are provided which run in parallel and are guided on one side of the housing ( 4 ) out of said housing.  
     
     
         9 . The electronic component of  claim 8 , wherein the leadframe ( 2 ) is fabricated out of a metal or a metal alloy.  
     
     
         10 . The electronic component of  claim 9 , wherein a thin anticorrosive film extends along at least a section of the lobe element ( 7 ).  
     
     
         11 . The electronic component of  claim 10 , wherein at least a section of the surface of the leadframe ( 2 ) is coated, and in particular, coated with an alloy which contains Zn or Zn—Pb.  
     
     
         12 . A method of fabricating an electronic component ( 1 ) including a leadframe ( 2 ) on which at least one electronic member ( 3 ) is located, and including a housing ( 4 ) which may be fabricated by a molding process using a mold ( 12 ), 
 characterized in    that at least one support surface ( 7 ) is provided on the leadframe ( 2 ) which rests against the mold ( 12 ) during the molding process.