Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Abstract

An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

What is claimed:  
     
         1 . An elastic conductive resin composition, comprising an elastic resin and an acicular conductive filler, said filler comprising a surface layer of gold, silver, nickel, or copper.  
     
     
         2 . The elastic conductive resin composition according to  claim 1 , wherein the acicular conductive filler comprises a whisker as a core material.  
     
     
         3 . The elastic conductive resin composition according to  claim 2 , wherein the acicular conductive filler comprises a high polymer whisker as a core material.  
     
     
         4 . The elastic conductive resin composition according to  claim 1 , wherein the resin is a silicone resin having an ultraviolet-curing property and a humidity-curing property.  
     
     
         5 . An electronic device, comprising: 
 an electronic part comprising at least one first electrode;    a substrate comprising at least one second electrode; and    at least one bump formed on the at least one first electrode, said bump formed from the elastic conductive resin composition of  claim 1 ,    wherein the at least one first electrode and the at least one second electrode are electrically connected to each other by physical contact of the at least one bump with the at least one second electrode.    
     
     
         6 . The electronic device according to  claim 5 , wherein the at least one bump has a shape that becomes gradually thin toward a tip portion of the at least one bump, and an aspect ratio of the at least one bump is in a range of about 0.1 to about 1.0.  
     
     
         7 . The electronic device according to  claim 5 , wherein the resin is a silicone resin having an ultraviolet-curing property and a humidity-curing property.  
     
     
         8 . An electronic device, comprising: 
 an electronic part comprising at least one first electrode;    a substrate comprising at least one second electrode; and    at least one bump formed on the at least one second electrode, said bump formed from the elastic conductive resin composition of  claim 1 ,    wherein the at least one first electrode and the at least one second electrode are electrically connected to each other by physical contact of the at least one bump with the at least one first electrode.    
     
     
         9 . The electronic device according to  claim 8 , wherein the at least one bump has a shape that becomes gradually thin toward a tip portion of the at least one bump, and an aspect ratio of the at least one bump is in a range of about 0.1 to about 1.0.  
     
     
         10 . The electronic device according to  claim 8 , wherein the resin is a silicone resin having an ultraviolet-curing property and a humidity-curing property.  
     
     
         11 . An electronic device, comprising: 
 an electronic part comprising at least one first electrode;    a substrate comprising at least one second electrode;    at least one bump formed on the at least one first electrode and formed from an elastic conductive composition comprising an elastic resin and a tetrapod-shaped zinc oxide filler comprising a surface layer of gold, silver, nickel, or copper,    wherein the at least one first electrode and the at least one second electrode are electrically connected to each other by physical contact of the at least one bump with the at least one second electrode.    
     
     
         12 . The electronic device according to  claim 11 , wherein the at least one bump has a shape that becomes gradually thin toward a tip portion of the at least one bump, and an aspect ratio of the at least one bump is in a range of about 0.1 to about 1.0.  
     
     
         13 . The electronic device according to  claim 11 , wherein the resin is a silicone resin having an ultraviolet-curing property and a humidity-curing property.  
     
     
         14 . An electronic device, comprising: 
 an electronic part including at least one first electrode;    a substrate including at least one second electrode;    at least one bump formed on the at least one second electrode and formed from the elastic conductive resin composition of  claim 1  wherein the filler is a tetrapod-shaped zinc oxide filler comprising a surface layer of gold, silver, nickel, or copper,    wherein the at least one first electrode and the at least one second electrode are electrically connected to each other by physical contact of the at least one bump with the at least one first electrode.    
     
     
         15 . The electronic device according to  claim 14 , wherein the at least one bump has a shape that becomes gradually thin toward a tip portion of the at least one bump, and an aspect ratio of the at least one bump is in a range of about 0.1 to about 1.0.  
     
     
         16 . The electronic device according to  claim 14 , wherein the resin is a silicone resin having an ultraviolet-curing property and a humidity-curing property.  
     
     
         17 . A connection part, comprising: 
 an elastic conductive element formed from the elastic conductive resin composition of  claim 1 , and    a metallic foil provided onto the elastic conductive element.    
     
     
         18 . An electronic part comprising: 
 at least one electrode; and    at least one bump formed on the at least one electrode, said bump formed from the elastic conductive resin composition of  claim 1 .    
     
     
         19 . A substrate comprising: 
 at least one electrode; and    at least one bump formed on the at least one electrode from the elastic conductive resin composition of  claim 1 .    
     
     
         20 . A method of forming a bump on an electrode, comprising: 
 screen-printing a conductive paste comprising a heat-curing silicone resin, a diluent, and an acicular conductive filler on said electrode;    heat-curing the conductive paste at a temperature lower than a complete curing temperature while evaporating the diluent; and    subsequently further heat-curing the conductive paste until a temperature of the conductive paste reaches the complete curing temperature.    
     
     
         21 . A method of forming a connection part comprising an elastic conductive element formed from an elastic conductive resin composition comprising-an elastic resin-and an acicular conductive filler, and a metallic foil provided onto the elastic conductive element, comprising: 
 coating a metallic foil with the elastic conductive resin composition at a predetermined thickness;    curing the elastic conductive resin composition; and    cutting the cured elastic conductive resin composition and the metallic foil.    
     
     
         22 . An electronic device, comprising: 
 an electronic part comprising at least one first electrode;    a substrate comprising at least one second electrode;    at least one bump formed on the at least one first electrode, and    at least one bump formed on the at least one second electrode, said bumps formed from the elastic conductive resin composition of  claim 1 ,    wherein the at least one first electrode and the at least one second electrode are electrically connected to each other by physical contact a) of the at least one bump on the at least one first electrode with the at least one second electrode, and b) of the at least one bump on the at least one second electrode with the at least one first electrode.    
     
     
         23 . An electronic device, comprising: 
 an electronic part comprising at least one first electrode;    a substrate comprising at least one second electrode;    at least one bump formed on the at least one first electrode and formed from an elastic conductive composition comprising an elastic resin and a tetrapod-shaped zinc oxide filler comprising a surface layer of gold, silver, nickel, or copper,    at least one bump formed on the at least one second electrode and formed from an elastic conductive composition comprising an elastic resin and a tetrapod-shaped zinc oxide filler comprising a surface layer of gold, silver, nickel, or copper,    wherein the at least one first electrode and the at least one second electrode are electrically connected to each other by physical contact of the at least one bump thereon with the other electrode.