Cleaning liquid used in photolithography and a method for treating substrate therewith

Abstract

It is disclosed a cleaning liquid for stripping and dissolving a photoresist pattern having a film thickness of 10-150 μm, which contains (a) 0.5-15 mass % of a quaternary ammonium hydroxide, such as tetrapropylammonium hydroxide and tetrabutylammonium hydroxide, (b) 65-97 mass % of a water-soluble organic solvent, such as dimethylsulfoxide or a mixed solvent thereof with N-methyl-2-pyrrolidone, sulforane, etc. and (c) 0.5-30 mass % of water, and a method for treating a substrate therewith.

What is claimed is:  
     
         1 . A cleaning liquid for stripping and dissolving a photoresist pattern having a film thickness of 10-150 μm, which contains (a) 0.5-15 mass % of a quaternary ammonium hydroxide represented by the following general formula (I):  
       
         
           
           
               
               
           
         
       
       wherein all groups or at least three groups of R 1 , R 2 , R 3 , and R 4  each independently represents an alkyl group or a hydroxyalkyl group each having 3-6 carbon atoms, and one group of R 1 , R 2 . R 3 , and R 4  may represent an alkyl group or a hydroxyalkyl group each having 1-6 carbon atoms, (b) 65-97 mass % of a water-soluble organic solvent, and, (c) 0.5-30 mass % of water.  
     
     
         2 . The cleaning liquid according to  claim 1 , wherein component (b) is dimethyl sulfoxide singly or a mixed solvent of dimethyl sulfoxide and other water-soluble organic solvents.  
     
     
         3 . The cleaning liquid according to  claim 1 , wherein component (b) is a mixed solvent of dimethyl sulfoxide and sulforane and/or N-methyl-2-pyrrolidone.  
     
     
         4 . The cleaning liquid according to  claim 1 , wherein component (b) is a mixed solvent of dimethyl sulfoxide and N-methyl-2-pyrrolidone.  
     
     
         5 . The cleaning liquid according to  claim 1 , wherein component (a) is at least one member selected from tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, methyltripropylammonium hydroxide, and methyltributylammonium hydroxide.  
     
     
         6 . The cleaning liquid according to  claim 1 , which contains 1-10 mass % of component (a), 70-96 mass % of component (b), and 1-25 mass % of component (c).  
     
     
         7 . The cleaning liquid according to  claim 1 , wherein the photoresist pattern is a photo-cured pattern formed using a negative-working photoresist composition that is polymerized upon irradiation with radiations and becomes insoluble in alkalis.  
     
     
         8 . A method for treating a substrate, comprising forming a photoresist pattern having a film thickness of 10-150 μm on a substrate having a metallic thin film thereon, providing a conductive layer on a metallic thin film-exposed area or a photoresist pattern uncovered area, and bringing the photoresist pattern into contact with the cleaning liquid according to any one of claims  1 - 7  to strip and dissolve the photoresist pattern.  
     
     
         9 . The method for treating a substrate according to  claim 8 , wherein the photoresist pattern is a photo-cured pattern formed using a negative-working photoresist composition that is polymerized upon irradiation with radiations and becomes insoluble in alkalis.  
     
     
         10 . A method for treating a substrate, comprising forming a photoresist pattern having a film thickness of 10-150 μm on a substrate having a metallic thin film thereon, bringing the photoresist pattern into contact with the cleaning liquid according to any one of claims  1 - 7  to strip and dissolve the photoresist pattern, without providing a conductive layer on a metallic thin film-exposed area or a photoresist pattern uncovered area.  
     
     
         11 . The method for treating substrate according to  claim 10 , wherein the photoresist pattern is a photo-cured pattern formed using a negative-working photoresist composition that is polymerized upon irradiation with radiations and becomes insoluble in alkalis.