Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same

Abstract

The present invention generally relates to an electrolyte solution used to manufacture an electrolytic copper foil for a secondary battery electrode collector and a printed circuit, and based on a 1-liter electrolyte solution, the present invention contains: 0.5 to 40 mg of at least one sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; 1 to 1000 mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin; and 0.1 to 80 mg of chlorine ion. The electrolytic copper foil in accordance with the present invention has a roughness Rz is less than 2.0 μm, if the electrolytic copper foil is in a thin film state, and has the roughness Rz value of the rough surface within a range of 1.0˜3.5 μm if the surface of the electrolytic copper foil is treated. Since a roughness value of a polished surface is changed according to polishing of a cathode surface, there is no special restriction.

What is claimed is:  
     
         1 . In an electrolyte solution containing at least selected one of sulfuric acid and copper sulfate used to manufacture an electrolytic copper foil by electrolysis, the electrolyte solution for manufacturing the electrolytic copper foil, based on the 1-liter electrolyte solution, comprising: 
 0.5 to 40 mg of at least one sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt;    1 to 1000 mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin; and    0.1 to 80 mg of chlorine ion added.    
     
     
         2 . The electrolyte solution of  claim 1 , wherein the dialkylamino- T- oxomethlyl- thioalkan sulfonic acid or the salt thereof is dithiocarbamic acid compound or salt thereof.  
     
     
         3 . The electrolyte solution of  claim 1 , wherein additives of the electrolyte solution further include 0.1 to 8 mg/L of thiourea derivative, a nitrogen compound.  
     
     
         4 . The electrolyte solution of  claim 1 , wherein the disulfur compound is SPS (Bis-(3-sulfopropyl)-disulfide, disodium salt)).  
     
     
         5 . The electrolyte solution of  claim 1 , wherein the organic compound is a poly aklylene glycol-type surfactant.  
     
     
         6 . A method of manufacturing an electrolytic copper foil, said method comprising steps of: 
 A) preparing an electrolyte solution added with 0.5 to 40 mg of at least one sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt, 1 to 1000 mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin, and 0.1 to 80 mg of chlorine ion, based on the 1-liter electrolyte solution;    B) generating the electrolytic copper foil on a cathode by flowing electricity after impregnating an anode and the cathode with the electrolyte solution.    
     
     
         7 . The method of  claim 6 , wherein the dialkylamino- T-oxomethyl-thioalkan sulfonic acid is dithiocarbamic acid compound, and the thioalkan sulfonic acid salt is dithiocarbamic salt.  
     
     
         8 . The method of  claim 6 , wherein 0.1 to 8 mg/L of thiourea derivative, a nitrogen compound is further included in the electrolyte solution.  
     
     
         9 . The method of  claim 6 , wherein the disulfur compound is SPS (Bis-(3-sulfopropyl)-disulfide, disodium salt).