US2004102140A1PendingUtilityA1
Contour following end effectors for lapping/polishing
Priority: Nov 21, 2002Filed: Nov 21, 2002Published: May 27, 2004
Est. expiryNov 21, 2022(expired)· nominal 20-yr term from priority
B25J 11/0065B25J 17/0275B25J 15/0019B24B 37/00B24B 19/26B24B 13/015B24B 27/0038
40
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Claims
Abstract
End effectors are provided for performing surface lapping using a robot. The end effectors allow orthogonal surface contact in order to maintain optimum pressure applied by the robot. The end effectors include a base, a plate having a planar surface, a lapping pad that attaches to the planar surface of the plate, and a pivot-joint. The pivot-joint allows the plate to pivot about two axes. The base is attached to an arm of the robot. The two axes are substantially parallel to the planar surface.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A robotic system for lapping a surface, the robotic system comprising:
a robotic arm; and an end effector unit including:
a base attached to the robotic arm;
a plate having a planar surface;
a lapping pad attachable to the planar surface of the plate; and
a pivot-joint for allowing the plate to pivot about two axes.
2 . The system of claim 1 , further comprising a pitch for attaching the lapping pad to the lapping plate.
3 . The system of claim 1 , wherein the two axes are substantially parallel to the planar surface.
4 . The system of claim 3 , wherein the pivot-joint includes a universal joint.
5 . The system of claim 3 , wherein the pivot-joint includes a gimbaled joint.
6 . The system of claim 3 , wherein the pivot-joint includes a ball and socket joint.
7 . The system of claim 6 , wherein the ball and socket joint includes a half-ball and socket joint.
8 . The system of claim 6 , wherein the ball and socket joint includes a crossed-pin ball and socket joint.
9 . The system of claim 1 , wherein the lapping pad includes a diamond lapping pad.
10 . A lapping end effector comprising:
a base; a plate having a planar surface; a lapping pad attachable to the planar surface of the plate; and a pivot-joint for allowing the plate to pivot about two axes.
11 . The system of claim 10 , further comprising a pitch for attaching the lapping pad to the lapping plate.
12 . The system of claim 10 , wherein the two axes are substantially parallel to the planar surface.
13 . The system of claim 12 , wherein the two axes are substantially orthogonal to a direction of pressure applied to the plate.
14 . The system of claim 12 , wherein the pivot-joint includes a universal joint.
15 . The system of claim 12 , wherein the pivot-joint includes a gimbaled joint.
16 . The system of claim 12 , wherein the pivot-joint includes a ball and socket joint.
17 . The system of claim 16 , wherein the ball and socket joint includes a half-ball and socket joint.
18 . The system of claim 16 , wherein the ball and socket joint includes a crossed-pin ball and socket joint.
19 . The system of claim 10 , wherein the lapping pad includes a diamond lapping pad.
20 . A robotic system for lapping a surface, the robotic system comprising:
a robotic arm; a support member coupled to the robotic arm; and a plurality of end effector units including:
a base attached to the support member;
a plate having a planar surface;
a lapping pad attachable to the planar surface of the plate; and
a pivot-joint for allowing the plate to pivot about two axes.
21 . The system of claim 20 , wherein the two axes are substantially parallel to the planar surface.
23 . The system of claim 21 , wherein the two axes are substantially orthogonal to a direction of pressure applied by the robotic arm.
24 . The system of claim 21 , wherein the pivot-joint includes a universal joint.
25 . The system of claim 21 , wherein the pivot-joint includes a gimbaled joint.
26 . The system of claim 21 , wherein the pivot-joint includes a ball and socket joint.
27 . The system of claim 26 , wherein the ball and socket joint includes a half-ball and socket joint.
28 The system of claim 26 , wherein the ball and socket joint includes a crossed-pin ball and socket joint.
29 . The system of claim 20 , wherein the lapping pad includes a diamond lapping pad.
30 . A method for lapping a surface, the method comprising:
applying pressure by a robot between a lapping pad attached to a plate having a planar surface and the surface; and pivoting the plate to move about two axes, wherein the two axes are substantially parallel to the planar surface and the applied pressure is substantially orthogonal to the two axes.Join the waitlist — get patent alerts
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