Semiconductor-producing/examining device
Abstract
It is an object of the present invention to provide a semiconductor-producing/examining device which can maintain a preferable connection state for a predetermined period of time and which can easily remove a ceramic substrate from a supporting case. The present invention is a semiconductor producing/examining device comprising: a ceramic substrate having a conductor layer formed on the surface thereof or inside thereof; and a supporting case; in which an external terminal is connected to the conductor layer, wherein a connection between the conductor layer and the external terminal is performed such that the external terminal is pressed on the conductor layer or the external terminal is pressed on another conductor layer connected to the conductor layer by using the elastic force and the like of an elastic body.
Claims
exact text as granted — not AI-modified1 . A semiconductor producing/examining device comprising:
a ceramic substrate having a conductor layer formed on the surface thereof or inside thereof; and a supporting case; in which an external terminal is connected to said conductor layer, wherein a connection between said conductor layer and said external terminal is performed such that:
said external terminal is pressed on said conductor layer; or
said external terminal is pressed on another conductor layer connected to said conductor layer.
2 . The semiconductor-producing/examining device according to claim 1 ,
wherein
the connection between said conductor layer and said external terminal, or
the connection between said another conductor layer and said external terminal
is performed by using elasticity of an elastic body.
3 . The semiconductor-producing/examining device according to claim 1 or 2 ,
wherein
the connection between said conductor layer and said external terminal, or
the connection between said another conductor layer and said external terminal
is performed through a non-oxidizable metal layer.
4 . The semiconductor-producing/examining device according to any of claims 1 to 3
wherein on a face of said ceramic substrate, which is the face opposite to the face for processing the semiconductor,
the connection between said conductor layer and said external terminal, or
the connection between said another conductor layer and said external terminal
is performed.Join the waitlist — get patent alerts
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