Polishing fluid composition

Abstract

To provide a polishing composition capable of increasing polishing rate and reducing surface roughness, without causing surface defects on a surface of an object to be polished; and a polishing process for a substrate to be polished. [1] a polishing composition comprising water, an abrasive, an intermediate alumina, and a polycarboxylic acid having 4 or more carbon atoms with no OH groups or a salt thereof, wherein a content of the intermediate alumina is from 1 to 90 parts by weight, based on 100 parts by weight of the abrasive; and [2] a polishing process for a substrate to be polished, comprising polishing a substrate to be polished under conditions that a composition of a polishing liquid during polishing is the composition as defined in item [1] above.

1 . A polishing composition comprising water, an abrasive, an intermediate alumina, and a polycarboxylic acid having 4 or more carbon atoms with no OH groups or a salt thereof, wherein a content of the intermediate alumina is from 1 to 90 parts by weight, based on 100 parts by weight of the abrasive.  
     
     
         2 . The polishing composition according to  claim 1 , wherein the intermediate alumina has a specific surface area of from 30 to 300 m 2 /g and an average particle size of from 0.01 to 5 μm.  
     
     
         3 . The polishing composition according to  claim 1  or  2 , wherein the intermediate alumina is prepared from aluminum hydroxide having a specific surface area of 10 m /g or more and a content of an alkali metal and an alkaline earth metal of 0.1% by weight or less.  
     
     
         4 . The polishing composition according to any one of  claims 1  to  3 , wherein a content of the polycarboxylic acid having 4 or more carbon atoms with no OH groups is from 0.05 to 20% by weight of the polishing composition.  
     
     
         5 . A polishing process for a substrate to be polished, comprising polishing a substrate to be polished under conditions that a composition of a polishing liquid during polishing is the composition as defined in any one of  claims 1  to  4 .