Method and apparatus for implementing measurement or instrumentation on production equipment

Abstract

A module for use in a process tool is disclosed. The module comprising an enclosure for housing a device to be tested; and a frame coupled to the enclosure. The frame includes a standard interface to the process tool and a kinematic interface to the enclosure to facilitate repeatable and high accuracy docking of the enclosure. These could be inspection components, measurement devices or other forms of instrumentation that are used for gathering information and/or analyzing data. The equipment could be used for, but not limited to, the fabrication of substrates, including semiconductor devices, reticles, and other products.

What is claimed is:  
     
         1 . A module for use in a process tool comprising: 
 an enclosure for housing a device to be tested; and    a frame coupled to the enclosure, the frame including a standard interface to the process tool and a kinematic interface to the enclosure to facilitate, repeatable and high accuracy docking of the enclosure.    
     
     
         2 . The module of  claim 1 , wherein the standard interface comprises a BOLTS interface.  
     
     
         3 . The module of  claim 1 , wherein the process tool comprises an equipment front end module (EFEM).  
     
     
         4 . The module of  claim 2 , wherein the kinematic interface comprises: 
 a plurality of spherical shaped objects on the frame which engage a plurality of machined features on the enclosure.    
     
     
         5 . The module of  claim 4 , wherein the machined features comprises a cone, groove or flat machined features.  
     
     
         6 . The module of  claim 1 , wherein the enclosure includes first an internal air path to keep a substrate located therein substantially clean.  
     
     
         7 . The module of  claim 6 , wherein the enclosure includes: 
 a second internal air path to cool electronics via the use of fans to draw heat air from the electronics out of the enclosure via ducts.    
     
     
         8 . The module of  claim 1 , wherein the enclosure includes fan modules for removing hot air from the module.  
     
     
         9 . The module of  claim 8 , wherein the enclosure includes an exhaust vent.