Methods and apparatus for activating openings and for jets plating

Abstract

One embodiment of the present invention is a method for electrofilling a metal or alloy inside at least one opening located in a front surface of a substrate, said front surface of the substrate includes the at least one opening and a top field surrounding the at least one opening, said at least one opening includes a bottom and sidewalls surfaces wherein at least the bottom surface comprises an exposed metallic surface, said method includes steps of: (a) immersing the substrate in an activation (or wetting) solution; (b) applying ultrasonic or megasonic vibrations to the substrate and to the activation (or wetting) solution; (c) applying high pressure electrolyte jets to the substrate, said electrolyte includes metallic ions of said metal or alloy; and (d) applying an electroplating current to the substrate to electroplate said metal or alloy inside the at least one opening.

What I claim is:  
     
         1 . A method for electrofilling a metal or alloy inside at least one opening located in a front surface of a substrate, said front surface of the substrate comprises the at least one opening and a top field surrounding the at least one opening, said at least one opening comprises a bottom and sidewalls surfaces wherein at least the bottom surface comprises an exposed metallic surface, said method includes steps of: 
 immersing the substrate in an activation (or wetting) solution;    applying ultrasonic or megasonic vibrations to the substrate and to the activation (or wetting) solution;    applying high pressure electrolyte jets to the substrate, said electrolyte comprises metallic ions of said metal or alloy; and    applying an electroplating current to the substrate to electroplate said metal or alloy inside the at least one opening.    
     
     
         2 . The method of  claim 1  wherein the electrolyte further comprises at least one inhibitor additive.