US2004083742A1PendingUtilityA1

Cooling system

Priority: Oct 31, 2002Filed: Oct 31, 2002Published: May 6, 2004
Est. expiryOct 31, 2022(expired)· nominal 20-yr term from priority
Inventors:Orlando Ruiz
H10W 40/475B41J 2/1408
32
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A cooling system that employs a coolant dispersal subsystem connected to a fluid ejector. The coolant dispersal subsystem is operable to supply liquid coolant to the fluid ejector. The fluid ejector is placed adjacent to a surface to be cooled and operable to eject the liquid coolant onto the surface.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A cooling system, comprising a coolant dispersal subsystem connected to a fluid ejector, the coolant dispersal subsystem operable to supply liquid coolant to the fluid ejector, the fluid ejector placed adjacent to a surface to be cooled and operable to eject the liquid coolant onto the surface.  
     
     
         2 . The system of  claim 1 , wherein the fluid ejector is a print head.  
     
     
         3 . The system of  claim 1 , further comprising a drive subsystem operable to selectively move the fluid ejector to a selected location adjacent to the surface.  
     
     
         4 . The system of  claim 3 , wherein the drive subsystem is operable to move the fluid ejector one dimensionally along a line adjacent to the surface.  
     
     
         5 . The system of  claim 4 , wherein the drive subsystem is operable to move the fluid ejector two dimensionally across a plane adjacent to the surface.  
     
     
         6 . The system of  claim 3 , further comprising a control subsystem in communication with a temperature sensing subsystem and the drive subsystem, the temperature sensing subsystem operable to detect localized temperatures of the surface, the control subsystem operable to detect when a localized temperature of an identified portion of the surface exceeds a threshold level and to direct the drive subsystem to position the fluid ejector adjacent to the identified portion of the surface.  
     
     
         7 . The system of  claim 6 , wherein the control subsystem is further operable to direct the coolant dispersal subsystem to supply the fluid ejector with liquid coolant and to actuate the fluid ejector ejecting the liquid coolant onto the identified portion of the surface.  
     
     
         8 . The system of  claim 1 , further comprising an array of two or more fluid ejectors each fluid ejector placed adjacent to the surface, wherein the coolant dispersal subsystem is operable to supply each fluid ejector with liquid coolant.  
     
     
         9 . The system of  claim 8 , further comprising a control subsystem in communication with a temperature sensing subsystem, the coolant dispersal subsystem, and the fluid ejectors, the temperature sensing subsystem operable to detect localized temperatures of the surface, the control subsystem operable to detect when a localized temperature of an identified portion of the surface exceeds a threshold level, to identify a fluid ejector adjacent to the identified portion of the surface, to direct the coolant dispersal subsystem to supply liquid coolant to the identified fluid ejector, and to actuate the identified fluid ejector ejecting the liquid coolant onto the identified portion of the surface.  
     
     
         10 . The system of  claim 1 , further comprising a control subsystem in communication with a temperature sensing subsystem, the coolant dispersal subsystem, and the fluid ejector, the temperature sensing subsystem operable to detect a temperature of the surface, the control subsystem operable to detect when the temperature exceeds a threshold level, to direct the coolant dispersal subsystem to supply liquid coolant to the fluid ejector, and to energize the fluid ejector ejecting the liquid coolant onto the surface.  
     
     
         11 . A cooling system, comprising: 
 a print head operable to eject a liquid coolant onto a surface to be cooled;    a coolant dispersal subsystem operable to supply the print head with liquid coolant;    a temperature sensing subsystem operable to detect localized temperatures of the surface;    a drive subsystem operable to move the print head to a selected location adjacent to the surface; and    a control subsystem in communication with the print head and the drive, temperature sensing, and coolant dispersal subsystems, the control subsystem operable to detect when a localized temperature of an identified portion of the surface exceeds a threshold level, to direct the drive subsystem to position the print head adjacent to the identified portion of the surface, to direct the coolant dispersal subsystem to supply the print head with liquid coolant, and to energize the print head ejecting the liquid coolant onto the identified portion of the surface.    
     
     
         12 . A cooling system, comprising: 
 an array of two or more print heads placed adjacent to a surface to be cooled;    a coolant dispersal subsystem operable to supply each print head with liquid coolant;    a temperature sensing subsystem operable to detect localized temperatures of the surface; and    a control subsystem in communication with the print head and the temperature sensing and coolant dispersal subsystems, the control subsystem operable to detect when a localized temperature of an identified portion of the surface exceeds a threshold level, to identify a print head adjacent to the identified position on the surface, to direct the coolant dispersal subsystem to supply the identified print head with liquid coolant, and to energize the identified print head ejecting the liquid coolant onto the identified portion of the surface.    
     
     
         13 . A cooling system, comprising a means for dispersing a liquid coolant to a means for ejecting the liquid coolant, the means for ejecting liquid coolant being placed adjacent to a surface to be cooled and operable to eject the liquid coolant onto the surface.  
     
     
         14 . A cooling system, comprising: 
 a fluid ejector operable to eject a liquid coolant onto a surface to be cooled;    a means for supplying the fluid ejector with liquid coolant;    a means for detecting when a localized temperature of the surface exceeds a threshold temperature;    a means for moving the fluid ejector to a position that is adjacent to portion of the surface that exceeds a threshold temperature; and    a means for actuating the fluid ejector in order to eject liquid coolant.    
     
     
         15 . A cooling system, comprising: 
 an array of two or more fluid ejectors placed adjacent to a surface to be cooled;    a means for supplying each fluid ejector with liquid coolant;    a means for detecting when a temperature of a portion of the surface exceeds a threshold level; and    a means for identifying a fluid ejector that is adjacent to a portion of the surface that has a temperature that exceeds the threshold level; and    a means for actuating an identified fluid ejector in order to eject liquid coolant.    
     
     
         16 . A cooling method, comprising: 
 positioning a fluid ejector adjacent to a surface to be cooled;    supplying the fluid ejector with a liquid coolant; and    actuating the fluid ejector in order to eject the liquid coolant onto the surface.    
     
     
         17 . The method of  claim 16 , wherein: 
 positioning comprises positioning a print head adjacent to a surface to be cooled;    supplying comprises supplying the print head with a liquid coolant; and    actuating comprises energizing the print head in order to eject the liquid coolant onto the surface.    
     
     
         18 . The method of  claim 16 , further comprising identifying when a temperature of the surface exceeds a threshold temperature before actuating the fluid ejector.  
     
     
         19 . The method of  claim 16 , further comprising identifying a portion of the surface having a temperature that exceeds a threshold temperature, and repositioning the fluid ejector adjacent to the identified portion of the surface.  
     
     
         20 . A cooling method, comprising: 
 positioning an array of two or more fluid ejectors adjacent to a surface to be cooled;    supplying the fluid ejectors with a liquid coolant; and    actuating at least one of the fluid ejectors in order to eject the liquid coolant onto the surface.    
     
     
         21 . The method of  claim 20 , wherein: 
 positioning comprises positioning an array of two or more print heads adjacent to a surface to be cooled;    supplying comprises supplying the print heads with a liquid coolant; and    actuating comprises energizing at least one of the print heads ejecting the liquid coolant onto the surface.    
     
     
         22 . The method of  claim 20  further comprising identifying a portion of the surface having a temperature that exceeds a threshold temperature, identifying a fluid ejector that is adjacent to the identified portion of the surface, and wherein supplying comprises supplying the identified fluid ejector with liquid coolant and, actuating, comprises actuating the identified fluid ejector to eject the liquid coolant onto the identified portion of the surface.

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