US2004083605A1PendingUtilityA1

Press-fit chip package

41
Assignee: IBMPriority: Jul 21, 2001Filed: Oct 30, 2003Published: May 6, 2004
Est. expiryJul 21, 2021(expired)· nominal 20-yr term from priority
Inventors:Willi RecktenwaldHelmut Schettler
H05K 2203/1581H05K 2203/061H05K 2201/1059Y10T29/49155H05K 2201/09536Y10T29/4913Y10T29/49126H05K 3/4602H05K 2203/1394H10W 72/07251H10W 72/20H10W 72/00
41
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A press-fit integrated chip package is provided comprising a laminate base structure having plated through holes for introducing press-fit elements, and a laminate cover structure providing very fine conducting paths and having a top mounting plane for mounting chips.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method of forming a press-fit integrated chip package comprising forming a laminate base structure having plated through holes for introducing press-fit elements, forming a laminate cover structure providing very fine conducting paths and having a top mounting plane for mounting chips, and forming a hybrid structure comprised of said laminate surface structure and said laminate cover structure.  
     
     
         2 . A method of forming a press-fit integrated chip package comprising forming a laminate base structure having plated through holes for introducing press-fit elements, forming a laminate cover structure providing very fine conducting paths and having a top mounting plane for mounting chips, and forming a sandwich structure being comprised of said laminate surface structure and said laminate cover structure, whereby said structures are subsequently mechanically and electrically conductive connected to each other.

Join the waitlist — get patent alerts

Track US2004083605A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.