Hybrid integrated circuit device and method for fabricating the same and electronic device

Abstract

A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.

1 . A hybrid integrated circuit device comprising: 
 a module substrate which is a ceramic wiring substrate;    a plurality of electronic component parts laid out over the main surface of said module substrate;    a plurality of electrode terminals laid out over the rear surface of said module substrate; and    a cap which is fixed to said module substrate to cover the main surface of said module substrate,    wherein electrode terminals which are located close to the edges of said module substrate are coated, at least in their portions close to the substrate edge, with a protection film.    
     
     
         2 . A hybrid integrated circuit device according to  claim 1 , wherein electrode terminals aligned along the edges of said module substrate are coated, at least in their portions close to the substrate edge, with a protection film.  
     
     
         3 . A hybrid integrated circuit device according to  claim 1 , wherein said protection film has a thickness of several tens micrometers or less.  
     
     
         4 . A hybrid integrated circuit device according to  claim 1 , wherein said module substrate has the formation of a plurality of semiconductor amplifying elements which are connected tandem to configure a high-frequency power amplifier module.  
     
     
         5 . A hybrid integrated circuit device comprising: 
 a module substrate which is a ceramic wiring substrate;    a plurality of electronic component parts laid out over the main surface of said module substrate;    a cap which is fixed to said module substrate to cover the main surface of said module substrate; and    a plurality of electrode terminals laid out over the rear surface of said module substrate,    wherein said electrode terminals include a plurality of electrode terminals which are aligned along the edges of said module substrate and power voltage supply terminals which are located inner than these electrode terminals.    
     
     
         6 . A hybrid integrated circuit device according to  claim 5 , wherein said power voltage supply terminals are comprised of a plurality of divided terminals which are independent of each other.  
     
     
         7 . A hybrid integrated circuit device according to  claim 5 , wherein said power voltage supply terminals include a plurality of terminals aligned along one side of said module substrate and a plurality of terminals aligned in the direction orthogonal to said one side.  
     
     
         8 . A hybrid integrated circuit device according to  claim 5 , wherein said power voltage supply terminals are ground terminals.  
     
     
         9 . A hybrid integrated circuit device according to  claim 5 , wherein said module substrate has the formation of a plurality of semiconductor amplifying elements which are connected tandem to configure a high-frequency power amplifier module.  
     
     
         10 . A hybrid integrated circuit device comprising: 
 a module substrate which is a ceramic wiring substrate;    a plurality of electronic component parts laid out over the main surface of said module substrate;    a plurality of electrode terminals laid out over the rear surface of said module substrate; and    a cap which is fixed to said module substrate to cover the main surface of said module substrate,    wherein said electrode terminals include a plurality of electrode terminals which are aligned along the edges of said module substrate and power voltage supply terminals which are located inner than these electrode terminals, said electrode terminals aligned along the edges of said module substrate being coated, at least in their portions close to the substrate edge, with a protection film.    
     
     
         11 . A hybrid integrated circuit device according to  claim 10 , wherein said power voltage supply terminals are comprised of a plurality of divided terminals which are independent of each other.  
     
     
         12 . A hybrid integrated circuit device according to  claim 10 , wherein said power voltage supply terminals include a plurality of terminals aligned along one side of said module substrate and a plurality of terminals aligned in the direction orthogonal to said one side.  
     
     
         13 . A hybrid integrated circuit device according to  claim 10 , wherein said power voltage supply terminals are ground terminals.  
     
     
         14 . A hybrid integrated circuit device according to  claim 10 , wherein said protection film is formed by printing to have a thickness of several tens micrometers or less.  
     
     
         15 . A hybrid integrated circuit device according to  claim 10 , wherein said module substrate has the formation of a plurality of semiconductor amplifying elements which are connected tandem to configure a high-frequency power amplifier module.  
     
     
         16 . A hybrid integrated circuit device comprising: 
 a module substrate which is a ceramic wiring substrate;    a plurality of electronic component parts laid out over the main surface of said module substrate;    a plurality of electrode terminals laid out over the rear surface of said module substrate; and    a rectangular metallic cap which is fixed to said module substrate to cover the main surface of said module substrate,    wherein said module substrate has the formation of ground terminals at the four corners thereof.    
     
     
         17 . A hybrid integrated circuit device according to  claim 16 , wherein said device has a means of fixing said cap over said module substrate, said fixing means being located at the four corners of said cap and said module substrate and connected electrically to said ground terminals.  
     
     
         18 . A hybrid integrated circuit device according to  claim 17 , wherein said module substrate has its four corners cut away to recess inwardly, with said fixing means being disposed in said recessed portions.  
     
     
         19 . A hybrid integrated circuit device according to  claim 17 , wherein said fixing means have their lower ends extending to reach or nearly reach the rear surface of said module substrate.  
     
     
         20 . A hybrid integrated circuit device according to  claim 16 , wherein said electrode terminals are aligned along the edges of said module substrate, with at least portions thereof close to the substrate edge being coated with a protection film.  
     
     
         21 . A hybrid integrated circuit device according to  claim 16 , wherein said electrode terminals include a plurality of electrode terminals which are aligned along the edges of said module substrate and power voltage supply terminals which are located inner than these electrode terminals.  
     
     
         22 . A hybrid integrated circuit device according to  claim 21 , wherein said protection film has a thickness of several tens micrometers or less.  
     
     
         23 . A hybrid integrated circuit device according to  claim 21 , wherein said power voltage supply terminals are ground terminals.  
     
     
         24 . A hybrid integrated circuit device according to  claim 16 , wherein said module substrate has the formation of a plurality of semiconductor amplifying elements which are connected tandem to configure a high-frequency power amplifier module.  
     
     
         25 . A method of fabricating a hybrid integrated circuit device which comprises: a module substrate which is a ceramic wiring substrate; a plurality of electronic component parts laid out over the main surface of said module substrate; a plurality of electrode terminals laid out over the rear surface of said module substrate; and a cap which is fixed to said module substrate to cover the main surface of said module substrate, 
 said method comprising the steps of:    overlapping a plurality of green sheets, with wiring patterns being formed thereon and pressing the sheets to make a laminated green sheet having an electrode terminal section over the rear surface;    printing paste to form a protective overlay so that terminals located close to the edges of said module substrate are coated, at least in their portions close to the substrate edge, with said protective overlay; and    annealing said laminated green sheet, said electrode terminal section and said protective overlay, thereby making said module substrate having electrode terminals which are partially coated with a protection film.    
     
     
         26 . A method of fabricating a hybrid integrated circuit device which comprises: a module substrate which is a ceramic wiring substrate; a plurality of electronic component parts laid out over the main surface of said module substrate; a plurality of electrode terminals laid out over the rear surface of said module substrate; and a cap which is fixed to said module substrate to cover the main surface of said module substrate, 
 said method comprising the steps of:    overlapping a plurality of green sheets, with wiring patterns being formed thereon and pressing the sheets to make a laminated green sheet having an electrode terminal section over the rear surface;    printing paste to form a protective overlay so that terminals are coated, at least in their rim section, with said protective overlay; and    annealing said laminated green sheet, said electrode terminal section and said protective overlay, thereby making said module substrate having electrode terminals which are partially coated with a protection film.    
     
     
         27 . An electronic device comprising a hybrid integrated circuit device and a setup board which has lands over the main surface thereof for fixing said hybrid integrated circuit device, said hybrid integrated circuit device having its electrode terminals connected electrically by soldering to the lands of said setup board, 
 wherein said hybrid integrated circuit device is the hybrid integrated circuit device set forth in  claim 1 .    
     
     
         28 . An electronic device according to  claim 27 , wherein said hybrid integrated circuit device comprises a high-frequency power amplifier module, and constitutes a wireless communication unit.  
     
     
         29 . An electronic device comprising a hybrid integrated circuit device and a setup board which has lands over the main surface thereof for fixing said hybrid integrated circuit device, said hybrid integrated circuit device having its electrode terminals connected electrically by soldering to the lands of said setup board, 
 wherein said hybrid integrated circuit device is the hybrid integrated circuit device set forth in  claim 5 , with said power voltage supply terminals being fixed by soldering to lands formed over the main surface of said setup board.    
     
     
         30 . An electronic device according to  claim 29 , wherein said hybrid integrated circuit device comprises a high-frequency power amplifier module, and constitutes a wireless communication unit.  
     
     
         31 . An electronic device comprising a hybrid integrated circuit device and a setup board which has lands over the main surface thereof for fixing said hybrid integrated circuit device, said hybrid integrated circuit device having its electrode terminals connected electrically by soldering to the lands of said setup board, 
 wherein said hybrid integrated circuit device is the hybrid integrated circuit device set forth in  claim 10 , with said power voltage supply terminals being fixed by soldering to lands formed over the main surface of said setup board.    
     
     
         32 . An electronic device according to  claim 31 , wherein said hybrid integrated circuit device comprises a high-frequency power amplifier module, and constitutes a wireless communication unit.  
     
     
         33 . An electronic device comprising a hybrid integrated circuit device and a setup board which has lands over the main surface thereof for fixing said hybrid integrated circuit device, said hybrid integrated circuit device having its electrode terminals connected electrically by soldering to the lands of said setup board, 
 wherein said hybrid integrated circuit device comprises: a module substrate which is a rectangular ceramic wiring substrate; a plurality of electronic component parts laid out over the main surface of said module substrate; a plurality of electrode terminals laid out over the rear surface of said module substrate; and a rectangular metallic cap which is fixed to said module substrate to cover the main surface of said module substrate, with means of fixing said cap to said module substrate being fixed by soldering to lands formed over the main surface of said setup board.    
     
     
         34 . An electronic device according to  claim 33 , wherein said module substrate has its four corners cut away to recess inwardly, with said fixing means being disposed in said recessed portions, and said cap has a rectangular profile.  
     
     
         35 . An electronic device according to  claim 33 , wherein said electrode terminals include a plurality of electrode terminals which are aligned along the edges of said module substrate and power voltage supply terminals which are located inner than these electrode terminals, said power voltage supply terminals being fixed by soldering to lands formed over the main surface of said setup board.  
     
     
         36 . An electronic device according to  claim 35 , wherein said electrode terminals aligned along the edges of said module substrate are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less.  
     
     
         37 . An electronic device according to  claim 33 , wherein said hybrid integrated circuit device comprises a high-frequency power amplifier module, and constitutes a wireless communication unit.  
     
     
         38 . An electronic device according to  claim 33 , wherein said module substrate has two pairs of confronting side sections and cut-away portions formed between adjacent side sections, said fixing means being disposed in said cut-away portions and fixed to lands which are laid out in rectangles created over the extended lines of said side sections.