Solder bump fabrication method and apparatus

Abstract

A solder bump fabrication method and apparatus. First, a printed circuit board, having a plurality of devices, is provided. A material is formed on the printed circuit board, and it is disposed between pins of the devices to prevent the devices from short-circuiting due to the solder bumps. Then, the solder bumps are formed on the pins of the devices so that the devices are fixed on the printed circuit board. The printed circuit board is passed through an infrared oven to melt the solder bumps. The material separates the solder bumps attached to the pins of the devices so that the devices are prevented from short-circuiting.

What is claimed is:  
     
         1 . An apparatus for printing characters on a printed circuit board, wherein the printed circuit board is provided with a plurality of devices with pins, and the apparatus is provided with a plurality of through holes corresponding to gaps between the pins on the printed circuit board, whereby isolated portions are formed between the pins on the printed circuit board while the characters are printed on the printed circuit board.  
     
     
         2 . A screen printing fixture for printing characters on a printed circuit board, wherein the printed circuit board is provided with a plurality of devices with pins, and the fixture is provided with a plurality of through holes corresponding to gaps between the pins on the printed circuit board, whereby isolated portions are formed between the pins on the printed circuit board while the characters are printed on the printed circuit board.