Method for manufacturing personal digital assistant

Abstract

A method for manufacturing a personal digital assistant (PDA) that contains an upper housing and a lower housing, includes forming a first portion and a second portion of the upper housing through plastic injection molding at one time, and forming at least one positioning stud on an inner side of the upper housing through plastic injection molding. The first portion can be electroplated, the second portion cannot be electroplated, and the positioning stud contains a surface that can be electroplated. The method further includes electroplating the upper housing so as to form an electrically conductive layer on the first portion and the surface of the positioning stud.

What is claimed is:  
     
         1 . A method for manufacturing a personal digital assistant (PDA), wherein the personal digital assistant comprises an upper housing and a lower housing, the upper housing comprising at least a first portion and a second portion, the first portion being capable of being electroplated and the second portion being incapable of being electroplated, the method comprising the following steps: 
 forming the first portion and the second portion of the upper housing through plastic injection molding at one time; and    electroplating the upper housing so as to form an electrically conductive layer on the first portion.    
     
     
         2 . The method of  claim 1  wherein the upper housing further comprises at least one positioning stud, the positioning stud being formed on an inner side of the upper housing through plastic injection molding.  
     
     
         3 . The method of  claim 2  wherein the positioning stud, the first portion and the second portion are formed through plastic injection molding at one time.  
     
     
         4 . The method of  claim 2  wherein the positioning stud comprises a surface that is capable of being electroplated, when electroplating the upper housing, forming an electrically conductive layer on the surface of the positioning stud that is capable of being electroplated.  
     
     
         5 . The method of  claim 4  wherein the personal data assistant further comprises a circuit board, one end of the positioning stud being connected to the circuit board.  
     
     
         6 . The method of  claim 1  wherein the first portion of the upper housing is a conductor.  
     
     
         7 . A method for manufacturing a personal digital assistant, wherein the personal data assistant comprises an upper housing and a lower housing, the upper housing comprising at least a first portion, a second portion and a positioning stud, the first portion being capable of being electroplated, the second portion being incapable of being electroplated, the method comprising the following steps: 
 forming the first portion and the second portion of the upper housing and the positioning stud on an inner side of the upper housing through plastic injection molding at one time; and    electroplating the upper housing so as to form an electrically conductive layer on the first portion of the upper housing.    
     
     
         8 . The method of  claim 7  wherein the positioning stud comprises a surface that is capable of being electroplated, when electroplating the upper housing, forming an electrically conductive layer on the surface of the positioning stud that is capable of being electroplated.  
     
     
         9 . The method of  claim 8  wherein the personal digital assistant further comprises a circuit board, one end of each positioning stud being connected to the circuit board.  
     
     
         10 . A method for manufacturing a personal digital assistant, wherein the personal digital assistant comprises an upper housing and a lower housing, the upper housing comprising at least a first portion, a second portion and a positioning stud, the first portion being capable of being electroplated, the second portion being incapable of being electroplated, the method comprising the following steps: 
 forming the first portion and the second portion of the upper housing and the positioning stud on an inner side of the upper housing through plastic injection molding at one time, wherein the positioning stud comprises a surface that is capable of being electroplated; and    electroplating the upper housing so as to form an electrically conductive layer on the first portion of the upper housing and on the surface of the positioning stud that is capable of being electroplated.    
     
     
         11 . The method of  claim 8  wherein the personal digital assistant further comprises a circuit board, one end of each positioning stud being connected to the circuit board.