Field replaceable packaged refrigeration module with capillary pumped loop for cooling electronic components

Abstract

A field and/or customer replaceable packaged refrigeration module with capillary pumped loop is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The field replaceable packaged refrigeration module is coupled to a capillary pumped loop and serves to lower the base temperature of the capillary pumped loop sub-system, thereby allowing intermittent operation of the field replaceable packaged refrigeration module with the capillary pumped loop sub-system.

What is claimed is:  
     
         1 . A packaged refrigeration module with capillary pumped loop for cooling electronic components, said packaged refrigeration module with capillary pumped loop comprising: 
 a packaged refrigeration module, said packaged refrigeration module comprising: 
 a packaged refrigeration module housing;  
 refrigerant;  
 a compressor;  
 a condenser;  
 an evaporator; and  
 an expansion device; wherein,  
   said compressor, said condenser, said evaporator and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and    a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop.    
     
     
         2 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.  
 
     
     
         3 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a single piston linear compressor.  
 
     
     
         4 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a dual-piston linear compressor.  
 
     
     
         5 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a multi-piston linear compressor.  
 
     
     
         6 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a rotary compressor.  
 
     
     
         7 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a reciprocating compressor.  
 
     
     
         8 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a rolling piston compressor.  
 
     
     
         9 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a rotary vane compressor.  
 
     
     
         10 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a screw compressor.  
 
     
     
         11 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a swash-plate compressor.  
 
     
     
         12 . The packaged refrigeration module with capillary pumped loop of  claim 1;  wherein, 
 said compressor is a scroll compressor.  
 
     
     
         13 . A circuit board, said circuit board comprising: 
 at least one electronic component;    a packaged refrigeration module for cooling said electronic component, said packaged refrigeration module comprising: 
 a packaged refrigeration module housing;  
 refrigerant;  
 a compressor;  
 a condenser;  
 an evaporator;  
 an expansion device; wherein,  
   said compressor, said condenser, said evaporator and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and    a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop; wherein,    said capillary pumped loop includes a capillary pumped loop reservoir, said capillary pumped loop evaporator reservoir being thermally coupled to said packaged refrigeration module evaporator; further wherein, 
 said packaged refrigeration module evaporator is mounted directly over a first surface of said electronic component.  
   
     
     
         14 . The circuit board of  claim 13;  wherein, 
 said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches  
 
     
     
         15 . The circuit board of  claim 13;  wherein, 
 said compressor is a single piston linear compressor.  
 
     
     
         16 . The circuit board of  claim 13;  wherein, 
 said compressor is a dual-piston linear compressor.  
 
     
     
         17 . The circuit board of  claim 13;  wherein, 
 said compressor is a multi-piston linear compressor.  
 
     
     
         18 . The circuit board of  claim 13;  wherein, 
 said compressor is a rotary compressor.  
 
     
     
         19 . The circuit board of  claim 13;  wherein, 
 said compressor is a reciprocating compressor.  
 
     
     
         20 . The circuit board of  claim 13;  wherein, 
 said compressor is a rolling piston compressor.  
 
     
     
         21 . The circuit board of  claim 13;  wherein, 
 said compressor is a rotary vane compressor.  
 
     
     
         22 . The circuit board of  claim 13;  wherein, 
 said compressor is a screw compressor.  
 
     
     
         23 . The circuit board of  claim 13;  wherein, 
 said compressor is a swash-plate compressor.  
 
     
     
         24 . The circuit board of  claim 13;  wherein, 
 said compressor is a scroll compressor.  
 
     
     
         25 . The circuit board of  claim 13;  wherein, 
 said electronic component is an integrated circuit.  
 
     
     
         26 . The circuit board of  claim 13;  wherein, 
 said electronic component is a microprocessor.  
 
     
     
         27 . An electronic system, said electronic system comprising: 
 a rack unit, said rack unit comprising: 
 at least one electronic component;  
 a packaged refrigeration module, said packaged refrigeration module comprising: 
 a packaged refrigeration module housing;  
 refrigerant;  
 a compressor;  
 a condenser;  
 an evaporator;  
 an expansion device; wherein,  
 
 said compressor, said condenser, and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and  
 a capillary pumped loop, said capillary pumped loop being operatively coupled to said packaged refrigeration module refrigeration loop; wherein,  
 said capillary pumped loop includes a capillary pumped loop reservoir, said capillary pumped loop evaporator reservoir being thermally coupled to said packaged refrigeration module evaporator; further wherein, 
 said packaged refrigeration module evaporator is mounted directly over a first surface of said electronic component.  
 
   
     
     
         28 . The electronic system of  claim 27;  wherein, 
 said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.  
 
     
     
         29 . The electronic system of  claim 27;  wherein, 
 said compressor is a single piston linear compressor.  
 
     
     
         30 . The electronic system of  claim 27;  wherein, 
 said compressor is a dual-piston linear compressor.  
 
     
     
         31 . The electronic system of  claim 27;  wherein, 
 said compressor is a multi-piston linear compressor.  
 
     
     
         32 . The electronic system of  claim 27;  wherein, 
 said compressor is a rotary compressor.  
 
     
     
         33 . The electronic system of  claim 27;  wherein, 
 said compressor is a reciprocating compressor.  
 
     
     
         34 . The electronic system of  claim 27;  wherein, 
 said compressor is a rolling piston compressor.  
 
     
     
         35 . The electronic system of  claim 27;  wherein, 
 said compressor is a rotary vane compressor.  
 
     
     
         36 . The electronic system of  claim 27;  wherein, 
 said compressor is a screw compressor.  
 
     
     
         37 . The electronic system of  claim 27;  wherein, 
 said compressor is a swash-plate compressor.  
 
     
     
         38 . The electronic system of  claim 27;  wherein, 
 said compressor is a scroll compressor.  
 
     
     
         39 . The electronic system of  claim 27;  wherein, 
 said electronic component is an integrated circuit.  
 
     
     
         40 . The electronic system of  claim 27;  wherein, 
 said electronic component is a microprocessor.